Redistribution Structure for Shorter Signal Paths in Stacked Chips
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Solution Overview
Problem
The scaling down of semiconductor devices poses challenges in achieving improved quality, yield, performance, and reliability while reducing complexity, particularly in data signal transmission and power consumption.
Innovation Solution
A semiconductor device design featuring a plug structure and redistribution layers that allow data signal transmission through upper and lower bonding pads and redistribution layers without passing through conductive features, reducing transmission distance and power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If data signal transmission path is extended through conductive features and functional units, then signal transmission distance increases, but power consumption increases and performance deteriorates
Solution Approach 1:
The patent segments the signal transmission path into separate functional layers: data signals are transmitted through dedicated redistribution layers while control signals pass through plug structures and functional units. This segmentation allows data signals to bypass unnecessary conductive features and functional units, reducing transmission distance and power consumption while maintaining proper signal routing.
2Productivity
If semiconductor device dimensions are scaled down, then computing ability demand is met, but quality, yield, performance, and reliability issues increase
Solution Approach 1:
The patent transitions from planar signal routing to a three-dimensional stacked architecture with multiple chips bonded together. Data signals are transmitted through redistribution layers in the horizontal plane while control signals travel vertically through plug structures. This dimensional change allows continued scaling of computing density without proportionally increasing signal transmission distances, thereby maintaining reliability and yield.
3Adaptability or versatility
If signal transmission path includes multiple conductive features and functional units, then device functionality is achieved, but device complexity increases
Solution Approach 1:
The patent extracts the data signal transmission function from the control signal path by creating dedicated redistribution layers for data signals. This separation removes unnecessary conductive features and functional units from the data signal path, reducing complexity while preserving all required device functionalities through the differentiated signal routing paths.
Data Source
AI summary
A semiconductor device includes a first chip including a first substrate including a center region and a peripheral region; a first center bonding pad above the center region of the first substrate; and a first peripheral bonding pad above the peripheral region of the first substrate; and a second chip on the first chip and including: a plurality of peripheral upper bonding pads at a peripheral region of the second chip and respectively on the first center bonding pad and the first peripheral bonding pad; a plurality of redistribution structures respectively on the plurality of peripheral upper bonding pads and extending toward a center region of the second chip; a plurality of center lower bonding pads at the center region of the second chip and respectively on the plurality of redistribution structures; and a plurality of storage units electrically coupled to the plurality of center lower bonding pads.