Redistribution Structure Shielding Plate Stress Management
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Solution Overview
Problem
The integration of multiple semiconductor devices in miniaturized electronic systems poses challenges due to the need for advanced packaging and assembling techniques that enhance electrical performance and reduce transmission loss, while existing methods struggle with mechanical stress and reliability in semiconductor packaging.
Innovation Solution
A semiconductor package design featuring a redistribution structure with multiple dielectric layers and metallization tiers, including shielding plates and anchor conductive vias, which dissipates mechanical stress and improves reliability by connecting active and dummy connective terminals to the encapsulant and shielding plates, respectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple semiconductor devices are integrated in miniaturized electronic systems, then device functionality and electrical performance are improved, but mechanical stress and reliability issues worsen
Solution Approach 1:
The package structure is divided into distinct functional regions including active die attach region, dummy die attach region, fan-out region, and scribe region. The redistribution structure is segmented into multiple metallization tiers (first, second, third tiers) separated by dielectric layers, allowing independent optimization of each segment for stress management and electrical performance.
Solution Approach 2:
A redistribution structure acts as an intermediary between the semiconductor die and external connections. This intermediate structure with multiple metallization tiers and dielectric layers manages mechanical stress transmission and provides electrical redistribution, resolving the contradiction between device integration and reliability.
2Reliability
If advanced packaging techniques are used to enhance electrical performance, then transmission loss is reduced, but manufacturing complexity increases
Solution Approach 1:
The redistribution structure serves multiple functions simultaneously: electrical signal redistribution, mechanical stress management, and structural support. The metallization tiers provide both electrical connectivity and mechanical reinforcement, while dielectric layers provide both insulation and stress distribution, reducing the need for separate dedicated components.
Solution Approach 2:
The package structure employs nested layers with the semiconductor die embedded in the first dielectric layer, which is surrounded by a second dielectric layer containing the redistribution structure. This nested arrangement integrates multiple functional elements in a compact configuration, managing complexity through hierarchical organization.
3Area of moving object
If die size is reduced for miniaturization, then device footprint is decreased, but mechanical stress concentration increases
Solution Approach 1:
The solution moves from two-dimensional planar stress distribution to three-dimensional stress management through multiple vertical layers. The stacked metallization tiers and dielectric layers provide additional dimensional pathways for stress distribution, allowing compact footprint while managing stress through the vertical dimension.
Solution Approach 2:
The package structure uses composite construction with alternating layers of conductive metallization materials and insulating dielectric materials. This composite structure provides both mechanical reinforcement to distribute stress and electrical functionality, allowing miniaturization without stress concentration.
4Reliability
If more metallization tiers are added to redistribution structure, then electrical connectivity is improved, but manufacturing precision requirements increase
Solution Approach 1:
The metallization tiers and dielectric layers are formed in a predetermined sequence during manufacturing, with each layer prepared in advance before assembly. The redistribution structure is pre-formed with aligned conductive traces and vias, reducing the precision requirements during final die attachment and connection steps.
Data Source
AI summary
A semiconductor package includes a semiconductor die, a redistribution structure and connective terminals. The redistribution structure is disposed on the semiconductor die and includes a first metallization tier disposed in between a pair of dielectric layers. The first metallization tier includes routing conductive traces electrically connected to the semiconductor die and a shielding plate electrically insulated from the semiconductor die. The connective terminals include dummy connective terminals and active connective terminals. The dummy connective terminals are disposed on the redistribution structure and are electrically connected to the shielding plate. The active connective terminals are disposed on the redistribution structure and are electrically connected to the routing conductive traces. Vertical projections of the dummy connective terminals fall on the shielding plate.