Redistribution Structure for Stacked Die Interconnect
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional systems for connecting stacked die in microelectronic devices with a redistribution structure often require additional height or can only extend to the surface of the supporting structure, limiting flexibility and increasing complexity and cost.
Innovation Solution
The proposed solution involves a microelectronic device configuration where a second semiconductor die can extend partially or completely over the first die, with wires connecting directly to the redistribution structure, allowing for flexible arrangement and direct communication without the need for additional height, using a molded component to support the redistribution structure and conductive traces and vias for interconnects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If conventional connecting structures are used to connect stacked die to redistribution structure, then electrical connection is achieved, but additional height above the uppermost stacked die is required
Solution Approach 1:
The patent transitions from vertical connection structures (requiring Z-dimension height) to lateral connection structures extending in the X-Y plane. The redistribution structure spreads out horizontally to provide connection paths, eliminating the need for additional vertical space above the stacked die while maintaining electrical connectivity.
Solution Approach 2:
The patent employs flexible routing paths that can adapt to different die stacking configurations. The connecting structures are designed to dynamically adjust their layout in the lateral plane, allowing flexible arrangement of stacked die without requiring fixed vertical clearance, thereby enabling both compact height and design flexibility.
2Adaptability or versatility
If conventional connecting structures are used, then electrical connection is provided, but the connecting structures extend only to the proximal surface of the supporting structure
Solution Approach 1:
The patent integrates the redistribution structure to extend both laterally and vertically, merging the functions of redistribution and connection into a single unified structure. This eliminates the need for separate connecting structures above the die, reducing manufacturing steps and complexity while providing versatile connection options to multiple die levels and external contacts.
Solution Approach 2:
The redistribution structure is designed to serve multiple functions simultaneously: it redistributes electrical signals laterally, provides vertical connections to stacked die through extended pathways, and interfaces with external contacts. This multi-functional design increases adaptability for different stacking configurations without proportionally increasing manufacturing complexity.
3Area of stationary object
If vertically stacking of die is performed to reduce lateral size, then lateral package size is reduced, but height of the package increases
Solution Approach 1:
The patent compensates for increased vertical height by redistributing connection pathways laterally in the X-Y plane. The redistribution structure extends horizontally to provide connection paths that would otherwise require vertical space, effectively trading vertical dimension for lateral dimension in the connection architecture, thereby maintaining compact overall package dimensions.
Solution Approach 2:
The patent nests the redistribution structure within the lateral footprint of the package, allowing connection pathways to be embedded within the horizontal space rather than extending outward. This nesting approach enables the redistribution structure to accommodate vertical connections from stacked die without increasing lateral dimensions, effectively hiding the height increase within the existing package envelope.
Data Source
AI summary
A microelectronic package includes at least two semiconductor die, one die stacked over at least partially another. At a least the upper die is oriented with its active surface facing in the direction of a redistribution structure, and one or more wires are coupled to extend from contacts on that active surface into conductive structures in the redistribution structure.