Redistribution Structure Thickness Variation for Crack Reduction
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Solution Overview
Problem
The challenge lies in developing electronic devices with enhanced redistribution structures that can efficiently manage increased component requirements for smaller and more functional electronic products, while minimizing defects and production costs.
Innovation Solution
The proposed solution involves an electronic device design with a redistribution structure embedded in insulating layers, featuring a specific configuration of contact, pad, and line portions, where the pad portions have greater thicknesses to reduce stress-related defects and simplify the photolithography process, thereby improving durability and reducing manufacturing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the redistribution structure uses uniform thickness for contact, pad, and line portions, then the manufacturing process is simpler, but stress concentration occurs leading to cracks and reduced reliability
Solution Approach 1:
The patent applies local quality by varying the thickness of different portions of the redistribution structure. Specifically, the pad portion has a greater vertical thickness than the line portion, creating localized thickness variations that reduce stress concentration at critical interfaces. This non-uniform thickness distribution improves reliability without requiring complex multi-layer structures, as it can be achieved within a single redistribution layer.
2Reliability
If the pad portion has greater thickness than the line portion, then stress-related defects are reduced, but the photolithography process becomes more complex
Solution Approach 1:
The patent applies parameter changes by modifying the vertical thickness parameter of the pad portion relative to the line portion. This thickness variation is achieved through controlled deposition or etching processes that adjust the dimensional parameter locally. The pad portion's greater thickness provides improved mechanical durability and stress distribution, while the parameter change is implemented using standard semiconductor fabrication techniques.
3Stability of the object's composition
If multiple insulating layers are used to embed the redistribution structure, then the structure is more stable, but the manufacturing process becomes more complex
Solution Approach 1:
The patent applies segmentation by dividing the insulating structure into multiple distinct layers: a first insulating layer that embeds the lower redistribution structure and a second insulating layer that embeds the upper redistribution structure. This segmentation provides stable mechanical support and electrical isolation for each redistribution level. The segmented approach allows each insulating layer to be optimized independently for its specific function, enhancing overall structural stability.
Data Source
AI summary
An electronic device includes an upper insulating layer on a substrate. An upper redistribution structure is embedded in the upper insulating layer. The upper redistribution structure includes an upper contact portion, an upper pad portion, and an upper line portion between the upper contact portion and the upper pad portion. A passivation layer is on the upper insulating layer and the upper redistribution structure. An upper opening is configured to pass through the passivation layer and expose the upper pad portion. Vertical thicknesses of the upper pad portion and the upper contact portion are greater than a vertical thickness of the upper line portion.