Redistribution Structure Trenches for Thermal and Electrical Performance
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing chip carriers and semiconductor devices face challenges in achieving optimal thermal and electrical performance due to limitations in the design and thickness of electrically conductive layers, which affect routing density and manufacturing costs.
Innovation Solution
Incorporating a redistribution structure with a dielectric layer, electrically conductive layers, and filled trenches filled with a material different from the dielectric layer, which provides additional conductive and thermal pathways without increasing the thickness of the conductive layers, enhancing both electrical and thermal performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the thickness of electrically conductive layers is increased to improve current handling capability, then electrical performance improves, but device complexity and manufacturing costs increase
Solution Approach 1:
The patent introduces trenches extending in the horizontal direction within the dielectric layer, creating a third dimensional pathway for current flow. This allows current to be distributed across multiple horizontal planes rather than relying solely on increasing the vertical thickness of conductive layers, effectively resolving the contradiction by adding spatial dimensionality to current routing.
Solution Approach 2:
The patent divides the current routing function into multiple segments: the original electrically conductive layer and additional conductive pathways formed by filling trenches with conductive material. This segmentation allows current to be distributed across multiple separate conductive elements rather than requiring a single thick conductive layer, improving current handling while maintaining structural complexity at manageable levels.
2Reliability
If more conductive pathways are added to improve routing density, then electrical performance improves, but manufacturing complexity increases
Solution Approach 1:
The patent merges the formation of trenches and the filling process into a single manufacturing sequence. The trenches are formed in the dielectric layer and then filled with conductive material in an integrated process flow, combining what could have been separate complex steps into a unified manufacturing approach. This allows multiple conductive pathways to be created without proportionally increasing manufacturing complexity.
3Temperature
If conventional redistribution structures are used, then manufacturing is simpler, but thermal management performance is insufficient
Solution Approach 1:
The patent designs the trench filling structure to serve multiple functions simultaneously: it provides additional electrical conduction pathways for improved routing density and also acts as a thermal conduction pathway due to the thermal contact between the filling material and surrounding structures. This multi-functionality improves thermal management without requiring separate dedicated thermal management structures, resolving the contradiction between thermal performance and structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution improves electrical routing density and thermal management by allowing for higher current handling and reduced thermal resistance, thus outperforming conventional structures and avoiding the need for additional layers or complex manufacturing processes.
Implementation Method 1
improves electrical routing density and thermal management by allowing for higher current handling and reduced thermal resistance
Implementation Method 2
the redistribution structure includes: a dielectric layer extending in a horizontal direction; an electrically conductive layer arranged over the dielectric layer and extending in the horizontal direction
Data Source
AI summary
A chip carrier includes a redistribution structure, wherein the redistribution structure includes: a dielectric layer extending in a horizontal direction; a first electrically conductive layer arranged over the dielectric layer and extending in the horizontal direction; a trench arranged in the dielectric layer and extending in the horizontal direction; and a filling material filling the trench, wherein the filling material is different from the material of the dielectric layer.