Semiconductor Package Redistribution Substrate Optical Inspection
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Solution Overview
Problem
Current semiconductor packages face challenges in enhancing the reliability and durability of redistribution substrates, particularly in terms of absorbance and fluorescence properties, which affect the accuracy and reliability of inspection processes and ultimately the packaging process yield.
Innovation Solution
A semiconductor package is designed with a redistribution substrate that includes an organic dielectric layer with specific absorbance and fluorescence properties, incorporating a photo-imageable dielectric composition containing a base resin, cross-linking agent, elastomer, and photo active compound, which provides enhanced absorbance and fluorescence characteristics, enabling effective inspection and improved reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional dielectric materials are used in redistribution substrates, then manufacturing cost is reduced, but inspection accuracy and reliability deteriorate due to insufficient absorbance and fluorescence properties
Solution Approach 1:
The patent modifies the optical parameters of the dielectric layer by incorporating photoactive compounds and photosensitizers, achieving specific absorbance (≥0.04) and fluorescence intensity (≥4×10³) values in the 450-650nm wavelength range. This enables reliable inspection while maintaining manufacturing feasibility through established photo-imageable dielectric processes
Solution Approach 2:
The patent uses composite dielectric materials containing base resin, cross-linking agent, elastomer, photoactive compound, and photosensitizer. This composite structure provides both the required optical properties for inspection and the mechanical properties for packaging reliability
2Measurement precision
If dielectric layers with high absorbance and fluorescence intensity are used, then inspection accuracy improves, but material complexity and manufacturing difficulty increase
Solution Approach 1:
The patent specifies precise parameter ranges for the dielectric layer: maximum absorbance ≥0.04, fluorescence intensity ≥4×10³, and integral intensity ≥13 in the 450-650nm range. These quantified parameters enable systematic optimization of inspection accuracy while controlling material complexity
Solution Approach 2:
The patent applies photoactive compounds and photosensitizers specifically in the dielectric layer where optical inspection is required, rather than throughout the entire package structure. This localized approach improves inspection accuracy without unnecessarily complicating other components
3Reliability
If photo-imageable dielectric composition with multiple components is used, then absorbance and fluorescence properties improve for better inspection, but manufacturing process complexity increases
Solution Approach 1:
The patent incorporates photoactive compounds and photosensitizers into the dielectric layer during the formation process, before the inspection step. This preliminary action ensures the required absorbance and fluorescence properties are already present, simplifying the overall manufacturing flow despite the complex material composition
Solution Approach 2:
The patent combines multiple functions into the dielectric layer: structural support, electrical insulation, and optical inspection target. By merging these functions into a single multi-component material system, the patent improves package durability and inspection reliability without requiring separate components for each function
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the reliability and durability of semiconductor packages by improving absorbance and fluorescence properties, simplifying inspection processes, and increasing process yield through the use of a dielectric layer with defined absorbance and fluorescence conditions.
Implementation Method 1
The dielectric layer may have a maximum absorbance equal to or greater than about 0.04 at a first wavelength range
Implementation Method 2
a fluorescence intensity equal to or greater than about 4×10³ at the first wavelength range
Data Source
AI summary
Disclosed are semiconductor packages and their fabrication methods. The semiconductor package includes a redistribution substrate that includes an organic dielectric layer and a metal pattern in the organic dielectric layer, and a semiconductor chip on the redistribution substrate. The organic dielectric layer has a maximum absorbance equal to or greater than about 0.04 at a first wavelength range, and a fluorescence intensity equal to or greater than about 4×103 at the first wavelength range. The first wavelength range is about 450 nm to about 650 nm.