Redistribution Substrate Test Patterns for Semiconductor Package Yield
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Solution Overview
Problem
The challenge in the semiconductor industry is to reduce the size and weight of electronic components in portable devices while integrating multiple devices onto a single package, requiring innovative packaging solutions that enhance reliability and manufacturing efficiency.
Innovation Solution
A semiconductor package is designed with a redistribution substrate featuring vertically stacked dielectric layers and redistribution patterns, along with a method of fabrication that includes forming test patterns for process evaluation, allowing for the integration of multiple semiconductor chips and improved thermal management through a thermal radiation structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If multiple semiconductor devices are integrated on a single package to reduce size and weight, then the portability and integration density improve, but the manufacturing complexity and reliability challenges increase
Solution Approach 1:
The package is divided into multiple functional regions on the substrate: chip regions for mounting semiconductor chips, scribe line regions for separation and testing, and edge regions for redistribution patterns. This segmentation allows independent processing and testing of different areas, simplifying the overall manufacturing process while enabling high integration density.
Solution Approach 2:
Redistribution patterns and test structures are formed on the substrate before the semiconductor chips are mounted. This preliminary action allows the substrate to be prepared and tested in advance, enabling parallel processing and reducing the overall manufacturing complexity of the integrated package.
2Productivity
If multiple semiconductor chips are integrated on a single package, then the integration density improves, but the reliability of the package decreases due to increased interconnections and potential failure points
Solution Approach 1:
Test patterns are formed on the substrate before chip mounting, allowing the substrate's redistribution patterns and interconnections to be tested in advance. This preliminary testing identifies and isolates potential failure points before they affect the entire package, maintaining reliability while enabling high integration density.
Solution Approach 2:
The substrate acts as an intermediary between multiple semiconductor chips, providing a centralized platform for redistribution patterns and test structures. This intermediary approach allows independent testing and validation of the substrate's interconnection network, ensuring reliability before chips are mounted and interconnected.
3Manufacturing precision
If test patterns are formed on the substrate before chip mounting, then the manufacturing yield improves through early defect detection, but the substrate fabrication complexity increases
Solution Approach 1:
The test patterns are merged with the functional redistribution patterns on the same substrate layers. By combining testing and functional elements into a unified structure, the substrate fabrication process is enhanced rather than complicated, as the same patterning and deposition steps serve both testing and operational purposes.
Solution Approach 2:
The substrate is designed with multi-functionality: the same redistribution patterns serve both as functional interconnections for the semiconductor chips and as test structures for defect detection. This universal design allows a single fabrication process to create both testing and operational features, improving yield without significantly increasing fabrication complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach increases the reliability and manufacturing yield of semiconductor packages, reduces manufacturing costs, and enables the integration of multiple devices on a single package, addressing the need for smaller and lighter electronic components.
Implementation Method 1
a thermal radiation structure on the package substrate, the thermal radiation structure covering the redistribution substrate, the first semiconductor chip, and the second semiconductor chip
Data Source
AI summary
Disclosed are semiconductor packages and methods of fabricating the same. The semiconductor package includes a redistribution substrate that includes a chip region and an edge region around the chip region, and a semiconductor chip on the chip region of the redistribution substrate. The redistribution substrate includes a plurality of dielectric layers that are vertically stacked, a plurality of redistribution patterns on the chip region and in each of the dielectric layers, and a redistribution test pattern on the edge region and at a level the same as a level of at least one of the redistribution patterns.