Redistribution Substrate for Thin Semiconductor Packages
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Solution Overview
Problem
Current methods for manufacturing semiconductor packages are costly and struggle to produce thin, impact-resistant packages that protect semiconductor chips during handling.
Innovation Solution
A method using a redistribution substrate involves attaching a semiconductor chip to a support substrate with a mask layer and metal distribution layer, polishing the chip to 50 μm or less, and forming via holes to connect the chip to a printed circuit board, which are then filled with conductive material, allowing for thin and stackable semiconductor packages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional wire stacking methods are used to manufacture semiconductor packages, then the packages can be manufactured with established processes, but the manufacturing cost is high and the package thickness cannot be reduced effectively
Solution Approach 1:
The patent transitions from vertical wire stacking to a planar redistribution substrate approach, redistributing connection points horizontally across the substrate before connecting to the PCB. This dimensional shift enables thinner packages while maintaining electrical connectivity, as the connection paths are redistributed in the plane rather than stacked vertically through wires.
Solution Approach 2:
The redistribution substrate acts as an intermediary component between the semiconductor chip and the PCB. This intermediate layer provides a flexible platform for routing connections and reducing the overall package thickness, eliminating the need for thick wire stacks while maintaining electrical connectivity through a structured intermediate medium.
2Length of stationary object
If the semiconductor chip is thinned to reduce package thickness, then the package becomes thinner, but the chip becomes more vulnerable to impacts during handling
Solution Approach 1:
The redistribution substrate serves as a protective cushioning layer attached to the back of the thinned semiconductor chip. This substrate provides mechanical support and impact absorption before handling or assembly operations occur, protecting the fragile thinned chip from damage while enabling the package thickness to be reduced.
Solution Approach 2:
The patent creates a composite structure combining the thinned semiconductor chip with the redistribution substrate. This composite construction maintains the thin profile needed for reduced package thickness while the substrate material provides the mechanical strength and impact resistance that the thinned chip would otherwise lack.
3Reliability
If a support substrate is used in the redistribution substrate structure, then the chip is protected during handling, but the overall package thickness increases
Solution Approach 1:
The redistribution substrate is implemented as a thin film structure that provides necessary mechanical support and protection to the chip without adding significant thickness. This thin film approach maintains chip protection during handling while minimizing the increase in overall package thickness, achieving a balance between reliability and compactness.
Data Source
AI summary
An inexpensive method of manufacturing a semiconductor package using a redistribution substrate that is relatively thin. The method includes: attaching a semiconductor chip to a redistribution substrate; attaching the redistribution substrate to which the semiconductor chip is attached to a printed circuit board; removing a support substrate of the redistribution substrate; forming via holes to expose a bond pad of the semiconductor chip and a bond finger of the printed circuit board; and filling the via holes with a conductive material. Meanwhile, a redistribution substrate to which at least one other semiconductor chip may be mounted on the redistribution substrate.