Redistribution Structure Internal Supports for Package Warpage Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The semiconductor industry faces challenges in minimizing stress and warping in package structures due to the integration of multiple interconnects and integrated circuit dies, which can lead to performance issues and reduced yield.
Innovation Solution
Incorporating internal supports within the redistribution structure, such as dummy dies or bulk materials, to provide structural stability and reduce stress, particularly by laterally overlapping with interconnect regions and integrated circuit dies, thereby enhancing the package's mechanical integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple interconnects and integrated circuit dies are integrated into the package structure, then the functionality and component density are improved, but stress and warping increase
Solution Approach 1:
The patent introduces an intermediary material layer between the integrated circuit dies and the package substrate to act as a stress buffer. This intermediate layer absorbs and distributes the thermal and mechanical stress generated by multiple interconnects and dies, preventing warping while maintaining the high functionality of the package structure.
Solution Approach 2:
The patent employs composite material structures combining different materials with complementary properties. The package structure integrates rigid support materials with flexible stress-absorbing materials, creating a composite system that provides both structural stability and stress relief for high-density component integration.
2Quantity of substance
If multiple interconnects and integrated circuit dies are integrated into the package structure, then the component density is improved, but warping and cracking increase
Solution Approach 1:
The patent applies beforehand cushioning by pre-positioning stress-absorbing material layers and support structures during the packaging process. These cushioning elements are strategically placed before final assembly to prevent warping and cracking from developing during subsequent thermal cycling and operational stress, thereby maintaining high component density without compromising reliability.
Solution Approach 2:
The patent utilizes parameter changes in material properties, particularly transitioning materials between different thermal and mechanical states during processing. By controlling temperature, pressure, and material phase changes during assembly, the patent optimizes stress distribution to enable high component density while preventing warping and cracking.
3Stability of the object's composition
If internal supports are added to the redistribution structure, then stress reduction is improved, but device complexity increases
Solution Approach 1:
The patent applies local quality by placing internal supports only in specific high-stress regions of the redistribution structure rather than uniformly throughout. This targeted approach provides effective stress reduction at critical locations while minimizing the overall addition of structural complexity to the device.
Data Source
AI summary
A device includes a redistribution structure, including conductive features; dielectric layers; and an internal support within a first dielectric layer of the dielectric layers, wherein the internal support is free of passive and active devices; a first interconnect structure attached to a first side of the redistribution structure; a second interconnect structure attached to the first side of the redistribution structure, wherein the second interconnect structure is laterally adjacent the first interconnect structure, wherein the internal support laterally overlaps both the first interconnect structure and the second interconnect structure.