Redistribution Structure Trenches for Package Device Stability
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Solution Overview
Problem
The miniaturization of semiconductor components leads to deformation and warping of redistribution structures, resulting in decreased contact yield and reliability between circuit board and redistribution structures, necessitating improved manufacturing methods for package devices.
Innovation Solution
A method involving the formation of trenches in the redistribution structure, filling with a second dielectric layer having a higher Young's modulus and lower thermal expansion coefficient than the first, and embedding protrusions to enhance structural stability and flatness, along with the use of conductive posts and connectors for electronic component integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the circuit board structure is stacked on the previously formed redistribution structure, then the integration and miniaturization requirements are met, but the redistribution structure is susceptible to extrusion resulting in deformation or warp
Solution Approach 1:
The patent introduces trenches that divide the redistribution structure into segmented regions. These trenches act as stress relief zones that prevent continuous deformation across the entire structure, thereby maintaining structural stability while enabling miniaturization and stacking.
Solution Approach 2:
The patent applies different material properties locally by filling trenches with dielectric material having different mechanical properties (higher Young's modulus, lower thermal expansion coefficient) than the surrounding redistribution structure. This local modification provides enhanced support precisely where needed to prevent deformation during stacking.
2Length of moving object
If the line width and pitch of circuit redistribution structure are reduced, then miniaturization requirements are met, but contact yield and overall reliability decrease due to deformation
Solution Approach 1:
The trenches are formed and filled with support material before the circuit board structure is stacked on the redistribution structure. This preliminary action pre-establishes mechanical support and stress distribution pathways, preventing deformation during the subsequent stacking process and ensuring reliable contact.
Solution Approach 2:
The patent changes the mechanical parameters of the redistribution structure by introducing trenches filled with material having different Young's modulus and thermal expansion coefficient. This parameter modification enhances the structure's resistance to deformation, thereby maintaining contact yield and reliability even when line width and pitch are reduced.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves contact yield, overall reliability, and structural flatness by preventing deformation and warping of the redistribution structure during circuit board formation, ensuring stable and reliable package device assembly.
Implementation Method 1
filling with a second dielectric layer having a higher Young's modulus and lower thermal expansion coefficient than the first
Implementation Method 2
filling with a second dielectric layer having a higher Young's modulus and lower thermal expansion coefficient than the first
Data Source
AI summary
A package device and a method for fabricating thereof are provided. The package device includes a substrate, a redistribution structure, a circuit board structure, a plurality of first connectors and a first electronic component. The redistribution structure is disposed over the substrate. The redistribution structure includes a first dielectric layer and a first metal layer. The circuit board structure disposed over the redistribution structure. The circuit board structure includes a second dielectric layer and a second metal layer. The second dielectric layer of the circuit board structure has a plurality of protrusions embedded in the first dielectric layer of the redistribution structure. A first electronic component is disposed on the redistribution structure, and the first connectors are interposed between the redistribution structure and the first electronic component to interconnect the two.