Redundant Computer Cooling Architecture for Vehicle Heat Failures
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Solution Overview
Problem
Modern vehicles, especially semi-autonomous and autonomous vehicles, face heat management challenges due to the high heat generated by powerful computer systems, which can lead to system failure and loss of vehicle control if not adequately cooled.
Innovation Solution
A thermal management assembly is implemented, utilizing two cooling systems in fluid communication with the computer system, including first and second thermal couplings, such as heat pipes or fluid circuits, to effectively transfer thermal energy and maintain a desired temperature, ensuring continuous operation even if one cooling system fails.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single cooling system is used for the computer system, then the device complexity is reduced, but the reliability deteriorates because the computer system may shut down if the cooling system fails due to heat
Solution Approach 1:
The patent implements a redundant cooling system architecture where a first cooling system and a second cooling system are both connected to the computer system. The first cooling system includes a first heat pipe and a first coolant circuit, while the second cooling system includes a second heat pipe and a second coolant circuit. This redundant configuration ensures that if one cooling system fails, the other can continue to cool the computer system, preventing shutdown due to heat accumulation.
Solution Approach 2:
The patent applies different cooling approaches to different thermal management needs. The first cooling system uses a heat pipe with a coolant circuit that circulates coolant through cooling blocks positioned at specific thermal hotspots on the computer system. The second cooling system provides alternative cooling paths. This localized cooling strategy addresses specific heat generation areas while maintaining overall system reliability through redundancy.
2Temperature
If air cooling is used in a vehicle environment, then the cooling method is simple, but the effectiveness deteriorates when the computer generates sufficient heat to render air cooling ineffective
Solution Approach 1:
The patent transitions from passive air cooling to active liquid cooling by implementing coolant circuits that circulate coolant through cooling blocks. The first coolant circuit flows coolant through first cooling blocks associated with the computer system, and the second coolant circuit flows coolant through second cooling blocks. This hydraulic cooling system efficiently removes heat from the computer system, overcoming the limitations of air cooling in confined vehicle environments where heat accumulation occurs.
Solution Approach 2:
The patent introduces coolant as an intermediary substance to transfer heat from the computer system. The coolant circulates through cooling blocks that are thermally coupled to the computer system components, absorbing heat and transporting it to heat exchangers where the heat is dissipated. This intermediary cooling mechanism is far more effective than direct air cooling, especially in the enclosed vehicle environment where heat can become trapped.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution efficiently cools the computer systems, reducing the risk of heat-related failures and ensuring the safe operation of autonomous vehicles by maintaining optimal temperatures, thereby enhancing reliability and performance in various environmental conditions.
Implementation Method 1
A thermal management assembly in fluid communication with a first cooling system and a second cooling system is coupled to the computer system to supply fluid from at least one of the first cooling system or the second cooling system to the computer system. In some examples, the thermal management assembly comprises a first thermal coupling to transfer thermal energy between the first cooling system and the computer system and further comprises a second thermal coupling to transfer thermal energy between the second cooling system and the computer system. In various examples, the first thermal coupling may comprise a first heat pipe or a first fluid circuit and the second thermal coupling may comprise a second heat pipe or a second fluid circuit to cool the computer system.
Implementation Method 2
A thermal management assembly in fluid communication with a first cooling system and a second cooling system is coupled to the computer system to supply fluid from at least one of the first cooling system or the second cooling system to the computer system
Implementation Method 3
the first thermal coupling may comprise a first heat pipe or a first fluid circuit and the second thermal coupling may comprise a second heat pipe or a second fluid circuit to cool the computer system
Data Source
AI summary
A thermal management assembly may implement cooling techniques to cool at least a portion of a computer system with one or more cooling systems. The techniques may include using a thermal management assembly in fluid communication with the cooling system(s) to supply fluid from at least one of the cooling systems to at least a portion of the computer system. The techniques may also or instead include using a first thermal coupling to transfer thermal energy between the first cooling system and the computer system and a second thermal coupling to transfer thermal energy between the second cooling system and the computer system. Cooling a computer system using the cooling techniques described herein lowers an operating temperature of the computer system thereby mitigating heat related computer failure.