Redundant Magnetic Sensor Chips for Error Detection
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Solution Overview
Problem
Magnetic field sensors in safety-critical applications require enhanced reliability, as single-point failures can lead to errors in speed and position measurements, particularly in vehicle systems like ABS and ESP, where conventional sensors lack redundancy and angular resolution.
Innovation Solution
A magnetic field sensor arrangement with two redundant differential sensor chips in a common housing, sharing a leadframe and terminals, with possible inverse polarity and lateral offset configurations to improve redundancy and angular resolution, while maintaining conventional package dimensions and using common or separate supply and ground terminals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single differential magnetic sensor is used in conventional sensor packages, then the device complexity is low, but the reliability is insufficient for safety-critical applications
Solution Approach 1:
The patent divides the sensing function into multiple independent sensor chips (at least two differential magnetic sensors) within a single sensor housing. Each sensor chip operates independently and provides separate output signals, allowing redundancy while maintaining a compact integrated package structure.
Solution Approach 2:
The patent combines multiple sensor chips into a single common housing that appears conventional from the outside. The multiple sensors are integrated within the same package, sharing common mounting structures and electrical connections, thereby increasing reliability without significantly increasing external dimensions or complexity.
2Measurement precision
If a single differential magnetic sensor is used, then the manufacturing precision requirements are low, but the measurement precision is insufficient
Solution Approach 1:
The patent employs multiple sensor chips positioned at different locations or orientations within the housing. This segmentation allows each sensor to contribute to the overall measurement, improving angular resolution through spatial distribution without requiring extremely tight manufacturing tolerances for individual components.
Solution Approach 2:
The patent utilizes spatial arrangement of multiple sensors in different positions or orientations (adding dimensional diversity) to improve measurement precision. By distributing sensors in space rather than relying on a single high-precision sensor, the system achieves better angular resolution with relaxed manufacturing requirements.
3Reliability
If redundant sensor chips are arranged in the housing, then the reliability is improved, but the housing dimensions increase
Solution Approach 1:
The patent nests multiple sensor chips within a single common housing structure. The sensors are arranged in a compact configuration that utilizes the internal volume efficiently, allowing redundant sensing elements to coexist without significantly increasing the external dimensions of the overall package.
Solution Approach 2:
The patent merges multiple sensor chips into a unified housing structure with shared mounting features and electrical connections. This consolidation allows the redundant sensors to occupy space efficiently within the existing package footprint, minimizing the increase in overall housing dimensions while maintaining reliability benefits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The redundant sensor configuration enhances reliability by providing identical or complementary output signals, improving angular resolution and error detection capabilities, thus ensuring accurate speed and position measurements in safety-critical applications.
Implementation Method 1
a first sensor chip having an integrated first differential magnetic field sensor circuit arranged in a sensor housing and a second, separate sensor chip having an integrated second differential magnetic field sensor circuit arranged in the sensor housing
Data Source
AI summary
A system includes a magnetic field sensor arrangement and a controller. The magnetic field sensor arrangement includes a first sensor chip having an integrated circuit differential magnetic field sensor circuit configured to generate a first output signal comprising first signal pulses, a second sensor chip having an integrated second differential magnetic field sensor circuit configured to generate a second output signal comprising second signal pulses, and at least one output signal terminal configured to output the first and the second output signals. The controller receives the first and the second signal pulses from the at least one output signal terminal, evaluates the first and the second signal pulses, and detects an error of an operation of the magnetic field sensor arrangement in response to the first and the second signal pulses not satisfying an expected output pattern of the first and the second signal pulses.