Electronics Packaging With Reel-to-Reel Multi-Layer Integration

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Current manufacturing processes for molded interconnect devices (MIDs) are inefficient in integrating complex electronic components into smaller spaces while reducing power consumption, heat, and cost.

Innovation Solution

The Application Specific Electronics Packaging (ASEP) system employs a reel-to-reel manufacturing process that involves depositing seed layers of traces on a substrate before electroplating, allowing for the integration of various components like connectors, sensors, and microprocessors, and enables multi-layer functionality by using a stamped carrier with a lead frame and overmolding a plastic substrate, followed by electroplating and component assembly.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If conventional batch processes are used to manufacture MIDs, then manufacturing precision and component integration are achieved, but manufacturing speed and production efficiency are reduced

Engineering Contradiction:

Improvemanufacturing speedVSAvoidcomponent integration complexity

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The manufacturing process is segmented into distinct sequential steps: molding the substrate, depositing seed layers, electroplating traces, and component assembly. This segmentation allows each step to be optimized independently while maintaining overall process efficiency and component integration capability.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Seed layers are deposited on the substrate before electroplating, and the substrate is molded before trace formation. These preliminary actions prepare the substrate in advance for subsequent processing steps, enabling faster overall manufacturing while ensuring proper component integration and electrical connectivity.

Inventive Principle:

Principle #10Preliminary action

2Volume of moving object

If device size is reduced to include more features, then space efficiency improves, but heat generation and power consumption increase

Engineering Contradiction:

Improvedevice sizeVSAvoidheat generation

Core Design Contradiction:

Volume of moving objectVSTemperature

Solution Approach 1:

The substrate is divided into regions with different properties: platable regions for circuit traces and non-platable regions for mechanical structures. This local differentiation allows optimized heat dissipation in critical areas while maintaining compact overall device size and reducing localized heat generation from dense component integration.

Inventive Principle:

Principle #3Local quality

3Adaptability or versatility

If two-shot molding with separate platable and non-platable parts is used, then functional integration is achieved, but manufacturing complexity and cost increase

Engineering Contradiction:

Improvefunctional integrationVSAvoidmanufacturing complexity

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

A single substrate material is used that can serve multiple functions: providing mechanical structure, accepting seed layer deposition, and forming the basis for electroplated circuit traces. This universal substrate eliminates the need for separate platable and non-platable parts, reducing manufacturing complexity while maintaining functional integration.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The platable and non-platable functions are merged into a single substrate and processed in a unified manufacturing sequence. The seed layer deposition and electroplating steps are applied selectively to appropriate regions of the same substrate, combining what were previously separate manufacturing processes into one integrated flow.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables faster, cost-effective, and efficient production of complex electronic devices with reduced size and power consumption, allowing for the integration of multiple components in a single product, improving manufacturing speed and reducing the overall cost compared to conventional batch processes.

Implementation Method 1

depositing a seed layer of traces that connects to an internal buss formed by the carrier

Methodology Applied

Scientific EffectPhysical Vapour Deposition: Physical Vapour Deposition

Implementation Method 2

electroplating the seed layer of traces to form electronic circuit traces

Methodology Applied

Scientific EffectElectroplating: Electroplating

Data Source

PatentUS10667407B2Application specific electronics packaging systems, methods and devices

Publication Date: 2020.05.26 MOLEX INC

AI summary

Depicted embodiments are directed to an Application Specific Electronics Packaging (“ASEP”) system, which enables the manufacture of additional products using reel to reel (68a, 68b) manufacturing processes as opposed to the “batch” processes used to currently manufacture electronic products and MIDs. Through certain ASEP embodiments, it is possible to integrate connectors, sensors, LEDs, thermal management, antennas, RFID devices, microprocessors, memory, impedance control, and multi-layer functionality directly into a product.