Electronic Module Manufacturing via Reel-to-Reel Lamination
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current batch processes for manufacturing electronic modules, such as metal clad circuit boards, are inefficient due to high scrap rates and the need for time-consuming and costly changes in geometry, and they lack effective heat dissipation.
Innovation Solution
A method and system involving a layered structure with a conductive layer and a dielectric layer, supported by a carrier strip, which is processed to form circuits and then applied to an electronic module substrate, allowing for cost-effective and reliable production with enhanced heat dissipation capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If batch process manufacturing is used for metal clad circuit boards, then multiple electronic modules can be formed from one large sheet, but high scrap or waste material is generated between modules and production efficiency is reduced
Solution Approach 1:
The patent transitions from batch processing of large sheets to continuous reel-to-reel processing where the circuit board is manufactured as a continuous strip that is then segmented into individual modules. This segmentation approach eliminates the need for large margins between modules on a sheet, significantly reducing waste material while maintaining the ability to produce multiple modules.
Solution Approach 2:
The patent implements continuous manufacturing through reel-to-reel processing where the conductive strip and dielectric material are continuously fed and processed through lamination, circuit formation, and module creation without interruption. This continuous process eliminates the downtime and material waste associated with batch processing cycles.
2Adaptability or versatility
If new geometry or circuit is required in batch process, then circuit functionality is updated, but etch resist plate creation requires time and money investment
Solution Approach 1:
The patent replaces the physical etch resist plate with a digital mask or programming approach that defines circuit geometries. This allows circuit designs to be changed by modifying digital parameters or software code rather than creating new physical plates, enabling rapid adaptation to new geometries without time-consuming plate fabrication.
Solution Approach 2:
The patent substitutes the mechanical plate-based resist system with a digital or programmable system that controls the circuit formation process. This replacement eliminates the need for physical plate creation and allows for rapid reconfiguration of circuit geometries through software or digital mask changes.
3Temperature
If metal clad circuit boards are used for high power LED solutions, then adequate heat spreading is achieved, but additional heat sinks are required increasing device complexity
Solution Approach 1:
The patent combines the heat dissipation function directly into the circuit board substrate itself by using a metal core or metal layer as the primary heat spreading path. This integration eliminates the need for separate heat sink components, as the circuit board structure itself performs the thermal management function, thereby reducing device complexity while maintaining effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces waste, lowers production costs, and provides improved thermal efficiency for heat dissipation, making it suitable for high-power applications like LEDs without the need for additional heat sinks.
Implementation Method 1
laminating the dielectric material and the conductive strip to form a layered structure
Data Source
AI summary
A method of manufacturing an electronic module includes providing a conductive strip and a dielectric material. The method includes coating the dielectric material and the conductive strip to form a layered structure having a conductive layer defined by the conductive strip and a dielectric layer defined by the dielectric material. The method includes applying a carrier strip to the layered structure. The method includes processing the conductive layer to form a circuit while the layered structure is on the carrier strip. The method includes removing the carrier strip from the layered structure. The method includes applying the layered structure with the circuit to an electronic module substrate.