Reference Diode Junction Temperature Control

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Solution Overview

Problem

The challenge in accurately determining and controlling the junction temperature of semiconductor devices, especially heat-generating devices with high power density, leads to inaccuracies in device characterization and potential overheating, affecting their performance and circuit design.

Innovation Solution

A method involving a reference diode adjacent to the device under test is used to derive the junction temperature by obtaining current-temperature characteristics, applying a reverse bias, and adjusting the environment temperature to maintain the junction temperature within a predetermined range, utilizing a controller to stabilize the temperature.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a reference diode is used to determine junction temperature, then measurement precision is improved, but device complexity increases

Engineering Contradiction:
Improvejunction temperature determination accuracyVSAvoidtesting apparatus complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

A reference diode is introduced as an intermediary element to indirectly measure the junction temperature of the device under test. The reference diode, being in thermal contact with the device, provides a temperature indicator through its reverse saturation current characteristics, avoiding the need for direct temperature measurement at the junction.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent replaces direct physical temperature measurement mechanisms with an electrical measurement approach. By measuring the reverse saturation current of the reference diode and using it to infer temperature through established current-temperature relationships, the system substitutes complex thermal measurement hardware with simpler electrical measurement circuitry.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Manufacturing precision

If environment temperature is adjusted to control junction temperature, then temperature control precision is improved, but loss of time increases

Engineering Contradiction:
Improvejunction temperature control accuracyVSAvoidtemperature stabilization time
Core Design Contradiction:
Manufacturing precisionVSLoss of time

Solution Approach 1:

The system implements a feedback control mechanism where the junction temperature is continuously monitored through the reference diode's reverse saturation current, and the environment temperature is automatically adjusted based on the deviation from the target temperature. This closed-loop control improves temperature control accuracy while reducing stabilization time by actively correcting temperature deviations rather than relying on passive thermal equilibrium.

Inventive Principle:
Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances the precision of junction temperature determination and control, reducing inaccuracies and overheating risks, thereby improving device characterization and performance.

Implementation Method 1

obtaining a reverse saturation current of the reference diode

Methodology Applied
Scientific EffectReverse saturation current: Diode

Data Source

PatentUS10890614B2Method for determining a junction temperature of a device under test and method for controlling a junction temperature of a device under test
Publication Date: 2021.01.12 STAR TECHNOLOGIES INC
  • US10890614B2 patent drawing
  • US10890614B2 patent drawing
  • US10890614B2 patent drawing

AI summary

The present disclosure provides a method for controlling a junction temperature of a device under test, including applying a reverse bias to a reference diode adjacent to the device under test, obtaining a calibration current of the reference diode under the reverse bias, deriving the junction temperature of the device under test according to the reference diode, and adjusting an environment temperature when the junction temperature of the device under test is deviated from a predetermined value by a predetermined temperature range.