Reference Leak Manufacturing via Patterned Catalyst Nanostructures

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Solution Overview

Problem

Conventional reference leaks, such as platinum wire-glass, squeezed metal tube, and silica membrane helium leaks, have unpredictable leak rates due to randomly formed gaps, which are sensitive to temperature changes, leading to calibration uncertainties in leak detection and calibration processes.

Innovation Solution

A method involving the formation of patterned catalyst layers on substrates, followed by the growth of elongate nano-structures using chemical vapor deposition, and embedding these structures within a leak layer of metallic, glass, or ceramic materials, allowing for controlled creation of custom-tailored leak holes with predetermined dimensions and numbers to achieve a stable and customizable leak rate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If conventional methods (platinum wire-glass, squeezed metal tube, silica membrane) are used to create reference leaks, then the manufacturing process is simple, but the leak rate becomes unpredictable and temperature-sensitive

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidleak rate control
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent applies preliminary action by pre-forming patterned catalyst layers with specific geometries (lines, dots, grids) on the substrate before growing the nanostructures. This pre-planned catalyst pattern determines the exact position, shape, and size of the resulting leak holes, enabling precise leak rate control before the actual leak formation process occurs.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent changes physical parameters by controlling the catalyst layer thickness (5-50 nm), pattern geometry (line width, dot diameter, grid spacing), and CVD growth conditions to precisely control the final leak hole dimensions. By adjusting these parameters, the leak rate can be tailored to specific requirements while maintaining temperature stability.

Inventive Principle:
Principle #35Parameter changes

2Ease of manufacture

If random gap formation is used in conventional reference leaks, then the manufacturing process is straightforward, but the leak rate varies with temperature and requires calibration

Engineering Contradiction:
Improveprocess simplicityVSAvoidleak rate stability
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent applies local quality by creating catalyst layers with specific local patterns (lines, dots, grids) that determine where and how leak holes form. Different regions of the substrate can have different catalyst patterns, enabling spatial control over leak hole distribution, size, and shape, which results in predictable and stable leak rates insensitive to temperature variations.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent replaces the mechanical/random gap formation process with a controlled chemical vapor deposition process. Instead of relying on mechanical compression or thermal expansion to create random gaps, the CVD process grows nanostructures in precisely controlled locations and shapes defined by the catalyst pattern, eliminating randomness and temperature sensitivity.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Ease of manufacture

If conventional reference leaks are manufactured without patterned catalysts, then the manufacturing process is simple, but the leak holes cannot be artificially controlled

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidleak rate customization
Core Design Contradiction:
Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The patent applies segmentation by dividing the catalyst layer into discrete patterned elements (lines, dots, grids) that can be independently designed and positioned. This segmentation allows the leak holes to be created in specific configurations, enabling customization of leak rates for different applications while maintaining a relatively simple manufacturing process.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent enables leak rate customization by changing key parameters including catalyst pattern geometry (line width, dot diameter, grid spacing), catalyst layer thickness (5-50 nm), and CVD growth conditions. These parameter changes allow precise control over leak hole dimensions and distribution, making the reference leak adaptable to various detection requirements.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the production of reference leaks with precise, temperature-insensitive leak rates, reducing calibration errors and allowing for tailored leak rates for specific gas detection applications, enhancing the accuracy and reliability of leak detection and calibration processes.

Implementation Method 1

forming one or more predominantly one-dimensional, elongated nano-structures extending from the corresponding catalyst blocks, such elongate nano-structures being formed by a chemical vapor deposition method

Methodology Applied
Scientific EffectChemical vapor deposition: Chemical Vapour Deposition

Data Source

PatentUS7757371B2Process for manufacturing a reference leak
Publication Date: 2010.07.20 HON HAI PRECISION INDUSTRY CO LTD
  • US7757371B2 patent drawing
  • US7757371B2 patent drawing
  • US7757371B2 patent drawing

AI summary

A method for making a reference leak includes the steps of: (a) preparing a substrate; (b) forming a patterned catalyst layer on the substrate, the patterned catalyst layer comprising one or more catalyst blocks; (c) forming one or more elongate nano-structures extending from the corresponding catalyst blocks by a chemical vapor deposition method; (d) forming a leak layer of one of a metallic material, a glass material, and a ceramic material on the substrate with the one or more elongate nano-structures partly or completely embedded therein; and (e) removing the one or more elongate nano-structures and the substrate to obtain a reference leak with one or more leak holes defined therein.