Reference Pin Alignment for Substrate Cutting Stability

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Solution Overview

Problem

Existing substrate alignment and cutting technologies face challenges in maintaining accurate and stable alignment, particularly due to wear and cracking of reference pins, leading to improper substrate support and processing issues during flat display device production.

Innovation Solution

An apparatus with reference pins that have an upper end projecting further than the lower end, providing stable support and guiding cracks to the upper side, and a cutting portion on the stage for precise cutting, utilizing materials with superior impact resistance and anti-wear properties like PEEK to maintain alignment and prevent damage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If reference pins are used to support the substrate, then alignment stability is improved, but wear and cracking of reference pins occurs over time

Engineering Contradiction:
Improvealignment stabilityVSAvoidreference pin service life
Core Design Contradiction:
ReliabilityVSDuration of action of stationary object

Solution Approach 1:

The reference pin is divided into two separate components: a support body embedded in the stage and a reference end that contacts the substrate. This segmentation allows the reference end to be replaceable when worn or cracked, extending the overall service life while maintaining alignment stability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The reference end is designed as a consumable component that can be discarded when worn or damaged, while the support body is recovered and reused. This approach maintains continuous alignment stability without replacing the entire reference pin assembly.

Inventive Principle:
Principle #34Discarding and recovering

2Stability of the object's composition

If the reference pin upper end projects further than the lower end, then substrate support stability is improved, but crack propagation risk increases

Engineering Contradiction:
Improvesubstrate support stabilityVSAvoidreference pin integrity
Core Design Contradiction:
Stability of the object's compositionVSReliability

Solution Approach 1:

The reference end that is prone to cracking is extracted as a separate replaceable component from the support body. When cracking occurs, only the reference end needs to be replaced, not the entire pin, maintaining support stability while managing crack propagation risk.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The design anticipates crack propagation by providing a replaceable reference end that can be discarded before cracks propagate to the critical support body, cushioning against complete failure and maintaining reliability.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

3Ease of manufacture

If conventional reference pins are used, then manufacturing simplicity is maintained, but alignment precision deteriorates due to wear

Engineering Contradiction:
Improvereference pin manufacturingVSAvoidsubstrate alignment precision
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The reference pin is segmented into a support body and reference end, allowing the reference end to be manufactured with high precision from wear-resistant materials while keeping the overall structure simple and easy to manufacture.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The reference end is made from composite materials or materials with superior impact resistance and anti-wear properties, combining ease of manufacture with maintained alignment precision over extended service life.

Inventive Principle:
Principle #40Composite materials

Data Source

PatentUS10442101B2Method for aligning substrate and apparatus for cutting substrate using the same
Publication Date: 2019.10.15 SAMSUNG DISPLAY CO LTD
  • US10442101B2 patent drawing
  • US10442101B2 patent drawing
  • US10442101B2 patent drawing

AI summary

A method for aligning a substrate and an apparatus for cutting a substrate using the same are provided. In one aspect of the present invention, an apparatus for aligning a substrate comprises a stage on which the substrate is seated and reference pins provided to project from an upper surface of the stage. Each reference pin has a substrate support surface which supports one side of the substrate. An upper end of the substrate support surface is formed so as to project further toward the substrate than a lower end thereof.