Reflective Bonding Plate for Longer-Life Laser Chip Bonding
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Solution Overview
Problem
Laser bonding apparatuses face challenges in extending the lifespan of the laser light source, which affects the reliability and efficiency of the bonding process for semiconductor chips and light emitting devices.
Innovation Solution
The bonding apparatus incorporates a bonding plate with a reflective pattern and an optical system that includes a homogenizer, concave lens, and convex lens, along with a camera and mirror to align and focus laser light, and an ultrasonic generator to enhance bonding efficiency and extend the laser light source's lifespan.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If laser light source is used for bonding, then bonding speed and precision are improved, but lifespan of laser light source decreases
Solution Approach 1:
A bonding plate is introduced as an intermediary component between the laser light source and the substrate. The bonding plate includes a reflective pattern that reflects laser light back onto the substrate, enabling the laser light to be reused multiple times. This intermediary structure allows the laser light source to operate at lower intensity and for longer durations, thereby extending its lifespan while maintaining bonding effectiveness.
Solution Approach 2:
The reflective pattern on the bonding plate enables continuous reuse of laser light by reflecting it back onto the substrate. This creates a continuous useful action where the same laser light can perform multiple bonding operations or remain on the substrate for extended periods, reducing the need for frequent laser light source replacement and maintaining continuous productivity.
2Reliability
If laser light intensity is increased to improve bonding quality, then bonding reliability is improved, but laser light source lifespan decreases
Solution Approach 1:
The bonding plate with reflective pattern acts as a mediator that enables the laser light to interact with the substrate multiple times at lower intensity. The reflection mechanism ensures that sufficient energy is delivered for reliable bonding without requiring high initial laser intensity, thereby protecting the laser light source from premature degradation.
Solution Approach 2:
The reflective pattern creates periodic interaction between the laser light and the substrate through multiple reflections. This periodic action delivers energy in repeated cycles, ensuring reliable bonding accumulation without requiring sustained high-intensity laser operation, thus extending the laser light source lifespan.
3Duration of action of moving object
If bonding plate with reflective pattern is added, then laser light source lifespan is extended, but device complexity increases
Solution Approach 1:
The bonding plate serves multiple functions: it provides a physical bonding surface, incorporates a reflective pattern for light reflection, and acts as a structural support element. By combining these functions into a single component, the design avoids adding separate reflection mirrors or additional complexity while achieving laser light reuse and extended lifespan.
Solution Approach 2:
The reflective pattern is integrated directly into the bonding plate structure, merging the bonding function and the light reflection function into a single component. This integration eliminates the need for separate reflection elements and reduces overall device complexity while achieving the goal of extending laser light source lifespan.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively increases the lifespan of the laser light source, improving the bonding process's efficiency and reliability by optimizing the alignment and distribution of laser light, thereby enhancing the bonding of semiconductor chips and light emitting devices to substrates.
Implementation Method 1
The laser bonding apparatus may heat the semiconductor chip or light emitting device using laser light to bond the semiconductor chip to the substrate
Implementation Method 2
a reflective pattern provided above or below the transparent substrate and the transparent layer
Data Source
AI summary
Provided is a bonding apparatus. The bonding apparatus includes a stage configured to accommodate a substrate, a laser light source configured to provide laser light to devices on the substrate, and a bonding plate provided between the laser light source and the stage and configured to provide the devices on the substrate. The bonding plate includes a transparent substrate; a transparent layer below the transparent substrate; an device adhesion layer below the transparent layer and a reflective pattern provided above or below the transparent substrate and the transparent layer.