Reflective Layer Reduces Laser Energy for Flexible Device Separation
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Solution Overview
Problem
The existing laser release method for separating flexible devices from rigid substrates requires high laser energy due to the use of inorganic sacrificial layers, leading to high power consumption and inefficiency in the manufacturing process.
Innovation Solution
A method involving the formation of a reflective layer on the sacrificial layer to reflect laser energy back to the sacrificial layer, reducing the required laser energy for de-bonding and improving production efficiency by maintaining consistent laser energy throughout the process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an inorganic sacrificial layer (silicon nitride or silicon oxide) is used to separate the flexible device from the rigid substrate, then the separation can be achieved through laser release method, but the laser energy required is high and power consumption is high
Solution Approach 1:
The patent uses a composite structure consisting of an organic sacrificial layer (polyimide) combined with a reflective layer (metal layer). This composite structure allows the organic layer to be decomposed by laser while the reflective layer enhances laser energy absorption, reducing the overall laser energy required compared to using inorganic materials alone.
Solution Approach 2:
The patent changes the material parameter of the sacrificial layer from inorganic (silicon nitride/silicon oxide) to organic (polyimide). This parameter change fundamentally alters the laser interaction mechanism, allowing decomposition at lower laser energies while maintaining effective separation capability.
2Ease of manufacture
If a sacrificial layer is formed between the flexible device and the rigid substrate to facilitate separation, then the separation process can be performed, but relatively high laser energy is required when the sacrificial layer is made of inorganic material
Solution Approach 1:
The patent changes the material composition parameter of the sacrificial layer from inorganic to organic materials. This parameter change enables the separation process to proceed with lower laser power consumption while maintaining ease of manufacture and separation capability.
Solution Approach 2:
The patent employs an organic sacrificial layer that is designed to be temporarily present and easily decomposed. This disposable approach allows for simpler, lower-energy separation processes compared to using durable inorganic materials that require higher energy input for removal.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The reflective layer increases the energy absorbed by the sacrificial layer, reducing the necessary laser energy for separation and eliminating the need for energy adjustments, thereby enhancing the efficiency of the de-bonding process and maintaining the integrity of the flexible device.
Implementation Method 1
separating the substrate from the flexible device by irradiating the sacrificial layer using laser
Implementation Method 2
the reflective layer is arranged to reflect laser back to the sacrificial layer
Implementation Method 3
the laser release method utilizes a laser to break down the interface between the flexible device and the rigid substrate
Data Source
AI summary
A method for fabricating a flexible device is provided. The method includes forming a sacrificial layer on a substrate; and forming a reflective layer to reflect a laser for subsequently de-bonding the sacrificial layer from the rigid substrate back to the sacrificial layer to reduce required de-bonding energy of the laser over at least a portion of the rigid substrate. Further, the method includes forming a flexible device over the reflective layer; and separating the substrate from the sacrificial layer by irradiating the sacrificial layer using the laser.