Reflective Liquid Crystal Panel Thermal Conductive Member
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Solution Overview
Problem
Existing reflective liquid crystal panels experience uneven temperature distribution due to non-uniform heat dissipation, leading to faster degradation of liquid crystals in the central area and color unevenness in projected images.
Innovation Solution
A thermal conductive member is strategically positioned between the reflective liquid crystal panel and the heat dissipation member, ensuring greater contact at the center of the display region than at the edges, enhancing heat receiving efficiency and using a graphite sheet for improved thermal conductivity and ease of handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a thermally-conductive filling material is injected across the entirety of the display region, then heat dissipation is provided across the entire region, but the heat receiving efficiency is almost uniform throughout the display region and temperature distribution cannot be made sufficiently uniform
Solution Approach 1:
The patent applies local quality by positioning the thermally-conductive filling material specifically at the center of the display region rather than uniformly across the entire region. This creates a localized heat dissipation structure that targets the area with highest temperature, enabling non-uniform heat reception that compensates for the non-uniform temperature distribution. The filling material is confined within a recessed portion of the heat dissipation member, creating a localized thermal management zone.
Solution Approach 2:
The patent employs asymmetry by creating a center gap that is smaller than edge gaps, and by positioning the thermally-conductive filling material only at the center region. This asymmetric configuration creates different heat receiving efficiencies at different locations on the display region, with the center having higher heat receiving efficiency to counteract its higher temperature. This asymmetric heat dissipation structure directly addresses the symmetric but non-uniform temperature distribution problem.
2Temperature
If the heat dissipation member surface is curved in a convex shape, then the center gap is smaller than edge gaps, but the reflective liquid crystal panel is extremely small so the difference between center gap and edge gaps is extremely small
Solution Approach 1:
The patent applies local quality by creating a recessed portion specifically at the center of the heat dissipation member surface, rather than using a globally curved surface. This localized recessed structure creates a significant center gap reduction without requiring complex curvature control across the entire small panel surface. The recessed portion is defined by specific dimensional parameters (depth and diameter) that can be precisely controlled during manufacturing.
Solution Approach 2:
The patent segments the heat dissipation member surface into different regions: a recessed central portion and peripheral areas. This segmentation allows independent optimization of each region's thermal characteristics. The recessed portion serves as a dedicated heat reception zone with enhanced thermal coupling, while the peripheral areas maintain their original configuration. This segmentation approach simplifies manufacturing by focusing precision requirements on the localized recessed feature rather than the entire surface.
3Loss of energy
If the thermally-conductive filling material is disposed between the reflective liquid crystal panel and heat dissipation member, then heat from the display region is absorbed, but almost no difference in heat receiving efficiency exists throughout the display region
Solution Approach 1:
The patent applies local quality by confining the thermally-conductive filling material to the recessed portion at the center of the heat dissipation member. This localized placement creates a concentrated heat reception zone that targets the center of the display region, which is where the highest temperature occurs. The filling material's thermal conductivity is utilized specifically in this critical area, creating a gradient in heat receiving efficiency that matches the temperature distribution pattern.
Solution Approach 2:
The thermally-conductive filling material serves as an intermediary substance that enhances thermal coupling between the reflective liquid crystal panel and the heat dissipation member at the center region. This intermediary material fills the recessed portion and creates intimate thermal contact, facilitating efficient heat transfer from the panel to the heat dissipation member specifically at the location where it is most needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves uniform temperature distribution across the display region, suppressing liquid crystal degradation and color unevenness while simplifying manufacturing and installation processes.
Implementation Method 1
a thermal conductive member disposed between the first substrate and the heat dissipation member so as to make contact with the first substrate and the heat dissipation member
Data Source
AI summary
An electro-optical device includes: an element substrate and an opposing substrate disposed so as to oppose each other; liquid crystals encapsulated and sealed between the two substrates; a display region that displays an image by modulating incident light based on image information; a heat dissipation member disposed opposing a second surface of the element substrate, the second surface being on the opposite side as the opposing substrate; and a thermal conductive member disposed between the element substrate and the heat dissipation member. The dimension from the end portion of where the thermal conductive member and the element substrate make contact with each other to the end portion of the display region on the second surface of the element substrate is greater than the thickness of the element substrate.