Light Emitting Mounting Base with Reflective Core Structure
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Solution Overview
Problem
The manufacturing of light emitting device lead frames involves costly processes like punching and etching, resulting in significant waste and increased costs, while existing methods for improving light-emitting efficiency, such as flip-chip mounting with anisotropic conductive adhesives, also incur high costs and risk of cracking or splintering.
Innovation Solution
A method of manufacturing a light emitting element mounting base member using a plate-shaped insulating member with recess portions or through-holes, where core members with light-reflecting insulating members are disposed and squashed to form a flat surface, allowing for the exposure of electrical conductor cores and the use of light blocking resin to reduce waste and improve reflectivity, thereby reducing costs and enhancing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If punching or etching is used to form lead frames, then lead frames can be manufactured, but a large amount of waste and waste liquid is generated, leading to increased costs
Solution Approach 1:
The insulating member itself serves as the base member, eliminating the need for separate lead frame formation processes. The electrical conductor cores are directly exposed from the insulating member, allowing electrical connections without additional processing steps that generate waste.
Solution Approach 2:
The patent extracts the electrical conductor cores from the insulating member by removing portions of the insulating member, rather than forming separate lead frames through punching or etching. This extraction process eliminates the need for waste-generating formation processes.
2Illumination intensity
If flip-chip mounting with anisotropic conductive adhesive is used, then light-emitting efficiency is improved, but manufacturing cost increases and cracks or splintering may occur on the light-emitting element
Solution Approach 1:
The patent introduces a light-reflecting insulating member as an intermediary between the light-emitting element and the base member. This intermediary structure reflects light back through the light-emitting element to improve efficiency without requiring conductive adhesives that may cause cracking.
Solution Approach 2:
The patent uses light-reflecting materials (white or highly reflective surfaces) on the base member to reflect light back through the light-emitting element, improving light-emitting efficiency without the need for conductive adhesives that risk causing cracks.
3Reliability
If conventional lead frame manufacturing is used, then electrical connections are established, but manufacturing costs increase due to waste generation
Solution Approach 1:
The insulating member is designed to serve multiple functions simultaneously: providing electrical insulation, supporting electrical conductor cores for electrical connections, and acting as the base member structure. This multi-functionality eliminates the need for separate lead frames, reducing manufacturing costs.
Solution Approach 2:
The patent merges the functions of the base member and electrical connection structure into a single integrated component. The electrical conductor cores are directly formed from the insulating member, combining what were previously separate components (base member and lead frame) into one unified structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces manufacturing costs by minimizing waste and improving light-emitting efficiency through the use of light blocking resin and anisotropic electrical conductor structures, while preventing cracking and splintering, thus enhancing the productivity and reliability of light emitting devices.
Implementation Method 1
an anisotropic conductive connection is carried out, by arranging a light-reflecting anisotropic conductive adhesive... between the light-emitting element and the wiring board
Implementation Method 2
squashing upper surfaces and/or lower surfaces of the core members so that a flat surface is provided on each of upper and lower sides of the core members
Implementation Method 3
an anisotropic conductive connection is carried out, by arranging a light-reflecting anisotropic conductive adhesive... between the light-emitting element and the wiring board
Implementation Method 4
heating and pressurizing the light-emitting element onto the wiring board with an elastomer head
Data Source
Figure 1~3
Figure 4~5
Figure 6~7
AI summary
A method of manufacturing a light emitting element mounting base member (100) includes: providing a first insulating member (18) in a plate shape having a plurality of recess portions or a plurality of through-holes (37); disposing in each recess portion or in each through-hole (37) a plurality of core members (16), each equipped with a second insulating member (14) having light reflectivity on a surface of an electrical conductor core (12); squashing upper and/or lower surfaces of the core members (16) disposed in the first insulating member (18), and disposing a light blocking resin (20) into gaps between the squashed member cores (16) by insert molding; and exposing at least one surface of each of the electrical conductor cores (12) from the second insulating members (14) by removing a part of the second insulating members (14). A light emitting element mounting base member (100) obtained by said method of manufacturing a light emitting element mounting base member (100) is also provided.