Optical Device Package Reflective Isolation for Compact Emitters and Detectors

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Solution Overview

Problem

Optical device packages incorporating light emitting and detecting devices face challenges due to increased size and optical crosstalk or interference between these components, which existing technologies have not adequately addressed.

Innovation Solution

The optical device package design includes a substrate with embedded electronic chips, a clear encapsulation layer, an opaque isolation structure, and a patterned reflective layer, which reduces the package size, minimizes optical interference, and enhances thermal dissipation while providing electrical and optical isolation between light emitting and detecting devices.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If light emitting device and light detecting device are disposed close to each other on the substrate, then the package size is reduced, but optical crosstalk or interference between the devices increases

Engineering Contradiction:

Improvepackage sizeVSAvoidoptical crosstalk

Core Design Contradiction:

Area of stationary objectVSObject-affected harmful factors

Solution Approach 1:

An opaque isolation structure is introduced as an intermediary element positioned between the light emitting device and the light detecting device. This structure acts as a mediator that blocks optical signals from traveling directly between the two devices, thereby preventing crosstalk while allowing the devices to be disposed close together for compact packaging.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The optical path between the light emitting device and light detecting device is segmented by the opaque isolation structure. This divides the continuous optical field into separate zones, preventing direct optical coupling between the devices while maintaining their physical proximity on the substrate.

Inventive Principle:

Principle #1Segmentation

2Adaptability or versatility

If each device specifies its own controller ICs, then the devices can be controlled independently, but the overall size of the optical device package is increased

Engineering Contradiction:

Improveindependent control capabilityVSAvoidpackage size

Core Design Contradiction:

Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

Multiple controller ICs are merged into a single integrated controller chip that can independently control both the light emitting device and the light detecting device. This consolidation reduces the total number of separate IC components and their associated mounting space, thereby reducing the overall package size while maintaining independent control functionality through integrated circuit design.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

A single controller IC is designed with multi-functional capabilities to control both the light emitting device and the light detecting device. This universal controller performs multiple control functions that would otherwise require separate dedicated ICs, reducing component count and package size while preserving independent device control through software or logic implementation.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively reduces the size and thickness of the optical device package, shortens electrical paths, improves thermal dissipation, and minimizes optical crosstalk, enabling more efficient and compact applications such as lighting, sensors, and automotive systems.

Implementation Method 1

The patterned reflective layer is disposed on an upper surface of the clear encapsulation layer and at least overlaps the gap between the light emitting device and the light detecting device in a projection direction perpendicular to the surface of the substrate

Methodology Applied

Scientific EffectReflection: Reflection

Implementation Method 2

The opaque isolation structure is disposed between the light emitting device and the light detecting device

Methodology Applied

Scientific EffectOptical absorption: Absorption (EM radiation)

Implementation Method 3

The one or more electronic chips are at least partially embedded in the substrate, and electrically connected to the light emitting device and the light detecting device

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS11837686B2Optical device package and method for manufacturing the same

Publication Date: 2023.12.05 ADVANCED SEMICON ENG INC

AI summary

An optical device package includes a substrate, a light emitting device, a light detecting device, one or more electronic chips, a clear encapsulation layer and a patterned reflective layer. The substrate has a surface. The light emitting device is disposed on the surface of the substrate, the light detecting device is disposed on the surface of the substrate, and the light emitting device and the light detecting device have a gap. The one or more electronic chips are at least partially embedded in the substrate, and electrically connected to the light emitting device and the light detecting device. The clear encapsulation layer is disposed on the surface of the substrate and encapsulates the light emitting device and the light detecting device. The patterned reflective layer is disposed on an upper surface of the clear encapsulation layer and at least overlaps the gap between the light emitting device and the light detecting device in a projection direction perpendicular to the surface of the substrate.