Reflective Partition Grid for Crosstalk Reduction in Optoelectronic Semiconductor Components
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Solution Overview
Problem
In semiconductor chips with multiple emission fields, achieving effective optical separation between adjacent pixels is challenging, and existing methods often result in crosstalk due to the use of adhesives, which reduces the separation efficiency.
Innovation Solution
A reflective grid of partitions is applied directly onto the semiconductor chip, surrounding the emission fields, and a conversion element is applied on top, with a transparent adhesive ensuring mechanical stability and minimal projection beyond the partitions to prevent crosstalk, while a common conversion element covers all pixels for light conversion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive layers are used to attach conversion elements to semiconductor chips with multiple emission fields, then mechanical stability is improved, but optical separation between adjacent pixels deteriorates due to crosstalk
Solution Approach 1:
The patent divides the semiconductor chip surface into separate emission fields by introducing partition structures between adjacent pixels. These partitions segment the adhesive layer application areas, allowing each emission field to have its own dedicated adhesive region that does not extend into adjacent pixel areas, thereby preventing crosstalk while maintaining mechanical stability.
Solution Approach 2:
The patent applies adhesive material with different spatial distribution characteristics: within each emission field, adhesive provides mechanical bonding, but between adjacent emission fields, the adhesive is restricted or absent to prevent optical interference. This local differentiation of adhesive quality and distribution resolves the contradiction between overall mechanical stability and local optical separation.
2Object-affected harmful factors
If reflective partitions are applied directly onto the semiconductor chip, then optical separation between adjacent pixels is improved, but device complexity increases
Solution Approach 1:
The patent combines multiple functions into the partition structure: it serves as both an optical element (reflective surface for separating emission fields) and a structural element (defining adhesive application boundaries). This merging reduces the need for separate components and simplifies the overall device architecture while achieving effective optical separation.
Solution Approach 2:
The partition structure is designed to perform multiple functions simultaneously: optical reflection for crosstalk reduction, mechanical support for the conversion elements, and spatial definition for adhesive layer placement. This multi-functionality reduces device complexity by eliminating the need for separate components for each function.
3Use of energy by moving object
If conversion elements project significantly beyond the partitions, then light conversion efficiency is improved, but crosstalk between adjacent pixels increases
Solution Approach 1:
The patent allows the conversion elements to project slightly beyond the partitions (partial action) to maintain adequate light conversion efficiency, but restricts the projection extent to prevent excessive overlap into adjacent emission fields. This controlled partial projection optimizes the balance between conversion efficiency and crosstalk prevention.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces crosstalk between adjacent pixels by using a reflective grid and a carefully positioned conversion element, enhancing optical separation and allowing for the emission of mixed light, such as white light, without the drawbacks of adhesive layers.
Implementation Method 1
The reflective partitions preferably bring about optical separation between an emission field which is in operation and an emission field adjacent thereto
Implementation Method 2
In operation, the conversion element partially or completely converts primary radiation from the semiconductor chip which impinges on the conversion element into secondary radiation of another wavelength
Data Source
AI summary
An optoelectronic semiconductor component is specified that has a semiconductor chip having a main side, the main side comprising a plurality of emission fields that are arranged next to one another. The emission fields are individually and independently actuatable and, during operation, they are each used to couple radiation out of the semiconductor chip. The main side has reflective partitions mounted on it that are arranged between adjacent emission fields and at least partially surround the emission fields in a plan view of the main side. In addition, the main side has a conversion element mounted on it, having an underside, which faces the semiconductor chip, and an averted top. The partitions are formed from a different material from the semiconductor material of the semiconductor chip and jut out from the semiconductor chip in a direction away from the main side. The conversion element covers at least one emission field at least partially and is connected to said emission field in a mechanically robust fashion. The underside of the conversion element in the region of the covered emission field juts out from the partitions in a direction away from the main side by no more than 10% of the height of the partitions.