Reflective Resin Encapsulation for Higher LED Light Extraction
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Solution Overview
Problem
Existing light emitting modules face challenges in achieving high light extraction efficiency due to the inefficiencies in extracting light from individually controlled light emitting elements mounted on a single wiring board.
Innovation Solution
A light emitting module is manufactured by providing a wiring board with light emitting elements, disposing a first resin containing a light reflecting substance around the elements, and covering the lateral faces of the elements with the resin, while a second resin with phosphor covers the upper faces of the elements and the first resin.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If light emitting elements are mounted on a single wiring board for individual control, then the module can achieve high controllability and versatility, but the light extraction efficiency from each element is insufficient
Solution Approach 1:
The patent applies local quality by creating distinct resin regions with different optical properties: a first resin containing light reflecting substances is placed in peripheral areas to reflect downward light upward, while a second resin containing phosphors is placed in central areas to convert light wavelengths. This localized differentiation optimizes light extraction efficiency for each spatial zone while maintaining individual element control capability
Solution Approach 2:
The patent introduces resin materials as intermediary substances between the light emitting elements and the external environment. These resins serve as mediators that facilitate light extraction through two mechanisms: the first resin with light reflecting substances redirects downward-emitted light upward, and the second resin with phosphors converts light wavelengths, thereby improving overall light extraction efficiency without affecting the electrical control capability of individual elements
2Loss of energy
If resin is disposed between wiring board and light emitting elements to improve light extraction, then light utilization increases, but manufacturing precision and adhesion control become more difficult
Solution Approach 1:
The patent segments the resin application into distinct regions: the first resin is disposed in peripheral areas between the wiring board and light emitting elements, while the second resin is disposed in central areas. This segmentation simplifies manufacturing by allowing each resin type to be applied to specific zones with clear boundaries, reducing the complexity of precise placement while maintaining high light utilization efficiency through optimized optical paths in each region
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The described method achieves high light extraction efficiency by reflecting downward-emitted light from the light emitting elements upwards, utilizing a high concentration of light reflecting substance in the first resin and ensuring good adhesion and light utilization with the second resin.
Implementation Method 1
disposing a first resin in an area of the upper face of the wiring board and outward from a region in which the light emitting elements are mounted, wherein the first resin contains a light reflecting substance
Implementation Method 2
a second resin containing a phosphor
Data Source
AI summary
A method of manufacturing a light emitting module includes: providing a wiring board having an upper face on which a plurality of light emitting elements are mounted; disposing a first resin in an area of the upper face of the wiring board that is outward of a region in which the light emitting elements are mounted, wherein the first resin contains a light reflecting substance; and covering lateral faces of the light emitting elements with the first resin by spreading the first resin over the region in which the light emitting elements are mounted.