Reflective Sensing Module Simplified Fabrication
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing reflective sensing modules require complex cavity formation in carrier substrates, making the manufacturing process cumbersome and in need of simplification.
Innovation Solution
A reflective sensing module is developed with a light chip and sensor chip mounted on a top glass substrate, where the light chip emits beams through the glass, and the sensor chip detects reflective beams, using a simplified fabrication process involving solder balls, molding compounds, and redistribution layers to form electrical connections and via metals for efficient light and signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If two cavities are made in the carrier substrate to accommodate optical device and sensor die, then the optical device and sensor die can be electrically connected through TSVs and solder bumps, but the fabrication process becomes complicated and cumbersome
Solution Approach 1:
The patent extracts the optical device from the carrier substrate and places it directly on the sensor die, eliminating the need for cavities in the carrier substrate. This is achieved by mounting the optical device on the sensor die using solder bumps, thereby simplifying the fabrication process while maintaining electrical connections through TSVs in the sensor die alone.
Solution Approach 2:
The patent merges the optical device and sensor die into a single integrated structure by mounting the optical device directly on the sensor die. This combination eliminates the need for separate cavities in the carrier substrate and simplifies the overall fabrication process while maintaining reliable electrical connections through TSVs.
2Reliability
If a complex cavity structure is used in the carrier substrate, then electrical connections can be established through TSVs and solder bumps, but the manufacturing process becomes cumbersome and time-consuming
Solution Approach 1:
The patent removes the complex cavity structure from the carrier substrate and extracts only the essential electrical connection function, which is achieved through TSVs in the sensor die alone. This extraction simplifies the manufacturing process and improves productivity while maintaining reliable electrical connections.
Solution Approach 2:
Instead of placing the optical device in a cavity of the carrier substrate and connecting it through TSVs in the carrier substrate, the patent inverts the approach by mounting the optical device directly on the sensor die and establishing electrical connections through TSVs in the sensor die alone, thereby simplifying the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process and enables effective light transmission and detection, suitable for applications like health monitoring in wearable devices, where light beams can be used to detect health information such as pulse rate, and transmit data wirelessly for further processing.
Implementation Method 1
The light chip 21 may be a light emitting diode, a laser diode, a vertical cavity surface emitting laser (VCSEL) or the like
Implementation Method 2
The sensor chip 22 may be a photodiode, a phototransistor, a photomultiplier tube or the like
Data Source
AI summary
A reflective sensing module is disclosed which can be embedded in a wristband for sensing a health information of a person wearing it. The health information can be wireless transmitted directly or indirectly to the internet for a further process. The reflective sensing module comprises a top glass, a bottom circuitry configured on a bottom surface of the top glass, a light chip and a sensor chip are electrically coupled with the bottom circuitry of the top glass; wherein the light chip emits light beams upwards passing through the top glass to an object; the sensor chip detects reflective light beams downwards passing through the top glass for a further process.