Reflective Retaining Wall Structure for Micro LED Light Extraction
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Solution Overview
Problem
High-reflectivity metal grooves in micro light-emitting diodes can cause light shielding due to structural deviations and wide bottoms, reducing light extraction efficiency.
Innovation Solution
A reflective retaining wall with a first portion surrounding the side wall of the semiconductor layer and a second portion disposed on the surface, separated from the light-emitting surface by a distance, to prevent light blocking and improve light extraction efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a high-reflectivity metal groove is used to increase light extraction efficiency, then light extraction efficiency is improved, but structural deviation and wide bottom of the metal groove cause light shielding
Solution Approach 1:
The reflective retaining wall is divided into two portions: a first portion that surrounds the side wall of the semiconductor layer and a second portion disposed on the surface. This segmentation allows each portion to perform its specific function - the first portion provides reflection while the second portion is positioned to avoid blocking light, thus resolving the contradiction between achieving high reflectivity and preventing light shielding
Solution Approach 2:
The reflective retaining wall transitions from a conventional groove structure to a multi-dimensional structure with portions at different heights and positions. The first portion is positioned laterally around the semiconductor layer while the second portion extends upward on the surface, utilizing vertical dimensionality to avoid light blocking while maintaining reflective function
2Manufacturing precision
If the metal groove is made wider to accommodate manufacturing tolerances, then manufacturing precision is improved, but the light shielding effect increases
Solution Approach 1:
By transitioning to a multi-dimensional reflective retaining wall structure with portions at different heights, the design allows lateral dimensions to be optimized for manufacturing tolerance while the vertical positioning of the second portion ensures light is not blocked, effectively decoupling manufacturing precision requirements from light shielding effects
3Object-affected harmful factors
If the metal groove is made narrower to reduce light shielding, then light extraction efficiency is improved, but manufacturing precision requirements increase
Solution Approach 1:
Dividing the reflective retaining wall into two portions allows the first portion to be optimally positioned for light extraction without being constrained by the need to prevent light shielding, while the second portion handles the positioning requirements, thereby reducing overall manufacturing precision requirements while maintaining light extraction efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The configuration of the reflective retaining wall enhances light extraction efficiency and allows for preferable display quality by minimizing light shielding and increasing the light-emitting aperture ratio to 100%.
Implementation Method 1
The reflective retaining wall includes a first portion and a second portion. The first portion surrounds a side wall of the second-type semiconductor layer of each light-emitting device and exposes the light-emitting surface of each light-emitting device
Data Source
AI summary
A light-emitting device structure includes at least one light-emitting device and a reflective retaining wall. Each light-emitting device includes a first-type semiconductor layer, a light-emitting layer, and a second-type semiconductor layer. The light-emitting layer is located between the first-type semiconductor layer and the second-type semiconductor layer, and the second-type semiconductor layer has a light-emitting surface. The reflective retaining wall includes a first portion and a second portion. The first portion surrounds a side wall of the second-type semiconductor layer of each light-emitting device and exposes the light-emitting surface of each light-emitting device. The second portion is disposed on a surface of the first portion, and a connection portion between the second portion and the first portion is separated from the light-emitting surface by a distance.


