Reflow Oven VOC Purification and Inert Gas Recirculation
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Solution Overview
Problem
Reflow ovens face issues with volatile organic compounds (VOCs) from soldering flux accumulating and condensing, contaminating circuit boards and oven surfaces, requiring frequent maintenance and cleaning, especially when switching between air and inert gas modes.
Innovation Solution
A reflow oven design that allows operation in both air and inert gas modes, featuring a purification section with catalytic devices and a controllable discharge pipeline system, which effectively treats VOCs by recycling and purifying gases, reducing maintenance burden and gas consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If air is used as working atmosphere in reflow oven, then ventilation and pollutant discharge are simplified, but volatile pollutants accumulate and condense causing circuit board contamination and increased maintenance burden
Solution Approach 1:
The patent extracts volatile pollutants from the heating zone through dedicated exhaust pipelines positioned at each heating zone, separating the pollutant removal function from the general ventilation system. This extraction approach prevents pollutant accumulation and condensation on circuit boards while maintaining simplified air mode operation.
Solution Approach 2:
The patent introduces an intermediary pollutant discharge system that acts as a mediator between the heating zones and the external environment. The discharge pipelines and valves serve as intermediaries to control pollutant flow, preventing direct contact between volatile pollutants and circuit boards while allowing controlled discharge.
2Object-affected harmful factors
If inert gas is used as working atmosphere, then circuit board contamination is reduced, but gas consumption and cost increase
Solution Approach 1:
The patent recycles inert gas by capturing it through exhaust pipelines and returning it to the heating zones through circulation systems. This recovery approach reduces inert gas consumption while maintaining the protective atmosphere needed to prevent circuit board contamination.
Solution Approach 2:
The patent implements continuous inert gas circulation through the heating zones, maintaining a continuous protective atmosphere that prevents contamination. The gas is continuously recycled and reused rather than being consumed, reducing overall gas consumption while maintaining protection throughout the soldering process.
3Object-affected harmful factors
If purification section is added to treat volatile pollutants, then circuit board contamination is reduced, but device complexity increases
Solution Approach 1:
The patent segments the pollutant treatment system into modular heating zones, each with its own exhaust pipeline and valve. This segmentation allows independent control of pollutant discharge from each zone without requiring a complex centralized purification system, reducing overall device complexity while effectively preventing contamination.
Solution Approach 2:
The patent replaces complex mechanical purification systems with a simpler valve-controlled discharge system. Instead of using complex filtration or chemical purification mechanisms, the system uses electronically controlled valves to manage pollutant flow, reducing mechanical complexity while maintaining effectiveness.
4Ease of operation
If multiple discharge branch pipes are provided for each purification sub-zone, then pollutant discharge control is improved, but valve device complexity and maintenance burden increase
Solution Approach 1:
The patent merges multiple discharge functions into a single valve device that controls all discharge branch pipes. This unified control approach simplifies the valve device structure and reduces maintenance burden while maintaining precise control over pollutant discharge from multiple heating zones through a centralized control mechanism.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system efficiently manages VOCs in both modes, maintaining a clean environment, reducing maintenance needs, and conserving inert gas usage by allowing easy switching between air and inert gas operations.
Implementation Method 1
Each of the M purification sub-zones... forms a heating work unit with an internal circulation unit and an external circulation unit... The catalytic device and the heating device are provided in each purification sub-zone
Implementation Method 2
The catalytic device and the heating device are provided in each purification sub-zone... each of the N soldering sub-zones and the purification sub-zone in communication with the soldering sub-zone form a heating work unit
Implementation Method 3
The heat in the heating zones melts the solder paste and simultaneously vaporizes volatile organic compounds (referred to as 'VOCs') in the soldering flux and other additives in the solder paste to form vapor
Implementation Method 4
each of the N soldering sub-zones and the purification sub-zone in communication with the soldering sub-zone form a heating work unit including an internal circulation unit and an external circulation unit
Data Source
AI summary
The present disclosure provides a reflow oven, which comprises: a soldering section provided with N soldering sub-zones and comprising a heating zone and a cooling zone, the cooling zone comprising a soldering sub-zone; an inlet zone and an outlet zone respectively provided at two ends of the soldering section; a first inlet zone isolation duct in communication with an upper side or a lower side of the inlet zone; M purification sub-zones, wherein each of the M purification sub-zones is in communication with a corresponding one of the N soldering sub-zones, and M is less than or equal to N, wherein one end of the first inlet zone isolation duct is in communication with a communication port of the inlet zone, and the other end of the first inlet zone isolation duct is in communication with the soldering sub-zone of the cooling zone.