Optical Chip Protective Housing for Reflow-Stable Fiber Coupling
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Solution Overview
Problem
The interconnection of a photoelectric conversion apparatus and a switch substrate via a socket increases the distance and power consumption due to the inability of the fiber array unit to withstand high temperatures in the reflow soldering process, leading to potential misalignment and reduced coupling efficiency.
Innovation Solution
An optical chip design with a protective housing and coupling space between the PIC and the optical fiber connector, ensuring alignment and protection of the coupling ends, even in high-temperature environments, using a groove and protective housing to maintain alignment and prevent damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If the photoelectric conversion apparatus is soldered to the switch substrate for interconnection, then the distance and power consumption are reduced, but the fiber array unit cannot withstand the high temperature in the reflow soldering oven
Solution Approach 1:
The patent divides the interconnection system into two separate connection points: one for the photoelectric conversion apparatus (soldered to switch substrate) and another for the fiber array unit (mechanically crimped to switch substrate). This segmentation allows each component to be connected using the most appropriate method, enabling the photoelectric conversion apparatus to be soldered for low power consumption while the fiber array unit avoids high-temperature exposure through mechanical crimping.
2Reliability
If the photoelectric conversion apparatus and switch substrate are interconnected via a socket, then the fiber array unit is protected from high temperature damage, but the distance and power consumption increase
Solution Approach 1:
The patent divides the interconnection system into two separate connection points: one for the photoelectric conversion apparatus (soldered to switch substrate) and another for the fiber array unit (mechanically crimped to switch substrate). This segmentation allows each component to be connected using the most appropriate method, enabling the photoelectric conversion apparatus to be soldered for low power consumption while the fiber array unit avoids high-temperature exposure through mechanical crimping.
3Length of moving object
If the photoelectric conversion apparatus is soldered to the switch substrate, then the distance is reduced, but misalignment may occur during high-temperature processing
Solution Approach 1:
The patent divides the interconnection system into two separate connection points, allowing the photoelectric conversion apparatus to be soldered close to the switch substrate for minimal distance while the fiber array unit is mechanically crimped separately, avoiding high-temperature exposure that causes misalignment.
Solution Approach 2:
The switch substrate acts as an intermediary component that receives both the photoelectric conversion apparatus (via soldering) and the fiber array unit (via mechanical crimping). This intermediary structure enables precise alignment of the photoelectric conversion apparatus through soldering while protecting the fiber array unit from high-temperature misalignment through separate mechanical connection.
Data Source
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AI summary
Embodiments of this application disclose an optical chip, a photoelectric conversion apparatus, a co-packaged optics chip, and an optical communication device, which are configured to ensure that a first coupling end of an optical fiber and a second coupling end of an optical waveguide are always in a coupled state in a high-temperature environment, and further ensures coupling efficiency between the optical fiber and the optical waveguide. The optical chip shown in embodiments of this application includes an optical fiber connector, a photonic integrated circuit PIC, a protective housing, and an injection molding layer. The protective housing is located between the injection molding layer and the PIC, and coupling space is formed between the protective housing and the PIC. The optical fiber connector includes an optical fiber. The optical fiber connector has a first connection end that faces the PIC and a second connection end that is away from the PIC. A first coupling end of the optical fiber passes through the first connection end. The first coupling end and a second coupling end of an optical waveguide of the PIC both extend into the coupling space, and the first coupling end located in the coupling space is coupled to the second coupling end. The second connection end is configured to detachably connect to another optical fiber connector.