Reflowable Optical Proximity Sensor Modules for High-Temperature Assembly
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Solution Overview
Problem
Optical proximity sensor modules are vulnerable to damage during high-temperature manufacturing processes, which can affect their integration and performance in consumer electronics.
Innovation Solution
The development of opto-electronic modules made from reflowable materials, such as thermally stable polymers like epoxies, which allow for integration at elevated temperatures and simplify the manufacturing process by enabling direct assembly on printed circuit boards, reducing the need for traditional pick-and-place lens assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional proximity sensor modules are used in manufacturing processes, then the modules can be integrated into devices, but the high temperatures during manufacturing may damage the sensor modules
Solution Approach 1:
The patent applies parameter changes by modifying the material composition of the sensor module housing to use thermally stable polymers with high glass transition temperatures. This allows the module to withstand manufacturing temperatures of 260°C or higher without damage, resolving the contradiction between reliability and temperature exposure during manufacturing processes
2Manufacturing precision
If traditional pick-and-place lens assembly is used, then precise lens positioning can be achieved, but the manufacturing process becomes more complex and costly
Solution Approach 1:
The patent merges the lens assembly process with the housing molding process by integrating optical elements directly into the polymer housing structure. This eliminates the need for separate pick-and-place lens assembly operations, reducing manufacturing complexity while maintaining precision through the molded-in positioning features
Solution Approach 2:
The polymer housing serves multiple functions: it provides structural support, optical pathways, and precise lens positioning all in one component. This multi-functionality eliminates the need for separate lens mounting structures and assembly steps, simplifying the overall manufacturing process while maintaining positioning accuracy
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the reliability and cost-effectiveness of manufacturing by allowing the modules to withstand high temperatures and simplifying the assembly process, ensuring optimal performance and integration in devices like smartphones.
Implementation Method 1
a light emitter arranged within the first recess and configured to emit light at a first wavelength
Implementation Method 2
light emitted from the LED is reflected from an object back to the detector
Implementation Method 3
a light detector arranged within the second recess and configured to detect light at the first wavelength
Implementation Method 4
the first polymer (e.g., epoxy) material and the second polymer (e.g., epoxy) material are thermally stable up to at least 260° C
Implementation Method 5
The glass transition temperature of the thermoplastic polymer can be above 260° C
Implementation Method 6
an optics member arranged between the light emitter and the light detector and having a first optical interface and a second optical interface
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
An optical proximity sensor module includes a substrate, a light emitter mounted on a first surface of the substrate, the light emitter being operable to emit light at a first wavelength, and a light detector mounted on the first surface of the substrate, the light detector being operable to detect light at the first wavelength. The module includes an optics member disposed substantially parallel to the substrate, and a separation member, wherein the separation member is disposed between the substrate and the optics member. Multiple modules can be fabricated in a wafer-level process and can be composed of reflowable materials so that the modules can be incorporated more easily into devices whose manufacture occurs, at least in part, at elevated temperatures when the module is integrated into the device or during subsequent manufacturing processes.