Refractory Chamber Components With Low-Porosity Protective Coatings

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Solution Overview

Problem

Semiconductor processing chambers face erosion and contamination issues due to the use of aluminum components, which are not suitable for high-temperature ALD processes and lead to defects and contaminants, while refractory metals provide mechanical strength but lack uniform electrical and thermal conductivity.

Innovation Solution

A refractory metal component body with a coating comprising a metal oxide, metal fluoride, or metal oxyfluoride, and an optional aluminum layer for electrical conductivity, supported by a thermal uniformity layer, to maintain mechanical strength and provide uniform thermal and electrical conductivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Use of energy by moving object

If aluminum components are used in semiconductor processing chambers, then electrical and thermal conductivity are improved, but erosion and contamination occur during high-temperature processing

Engineering Contradiction:

Improveelectrical and thermal conductivityVSAvoiderosion resistance

Core Design Contradiction:

Use of energy by moving objectVSReliability

Solution Approach 1:

The patent applies composite materials by combining aluminum component body with protective coatings (alumina, aluminum fluoride, or aluminum oxyfluoride). The aluminum base material provides electrical and thermal conductivity, while the coating layer provides erosion and contamination resistance during high-temperature processing, thus resolving the contradiction between conductivity and erosion resistance.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The protective coating acts as an intermediary layer between the aluminum component and the harsh processing environment. This coating mediates the interaction by providing a barrier that prevents direct contact between the aluminum and erosive/contaminating substances, while still allowing the underlying aluminum to maintain its electrical and thermal conductivity functions.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Strength

If refractory metal components are used, then mechanical strength at high temperature is improved, but uniform electrical and thermal conductivity is lost

Engineering Contradiction:

Improvemechanical strengthVSAvoidelectrical and thermal conductivity

Core Design Contradiction:

StrengthVSUse of energy by moving object

Solution Approach 1:

The patent uses composite materials by combining refractory metal (such as stainless steel, nickel alloy, or titanium alloy) for the component body to provide mechanical strength at high temperatures, with aluminum or aluminum-containing coatings to restore and provide uniform electrical and thermal conductivity on the surface, thus resolving the contradiction between strength and conductivity.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent applies local quality by having different materials serve different functions: the refractory metal bulk provides mechanical strength and structural integrity, while the aluminum-containing surface layer or coating provides the necessary electrical and thermal conductivity. This local differentiation of material properties resolves the contradiction between strength and conductivity.

Inventive Principle:

Principle #3Local quality

3Reliability

If atmospheric plasma spray coating is used, then protection against erosion is improved, but particles and metal contamination are generated

Engineering Contradiction:

Improveerosion protectionVSAvoidparticles and metal contamination

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent replaces the mechanical atmospheric plasma spray coating process with a chemical vapor deposition or atomic layer deposition process to form the protective coating. This substitution of the coating formation method eliminates the mechanical aerosol generation that causes particle contamination, while still providing effective erosion protection through the deposited aluminum-based coating layer.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent employs inert or controlled atmosphere conditions during the coating deposition process (using CVD or ALD methods) to prevent contamination and particle generation. The controlled environment ensures that the coating is deposited without introducing harmful particles or metal contamination, while maintaining effective erosion protection.

Inventive Principle:

Principle #39Inert atmosphere (Inert environment)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution ensures mechanical integrity at high temperatures, reduces contamination, and provides uniform thermal and electrical conductivity, enabling effective semiconductor processing without defects or contaminants.

Implementation Method 1

An atomic layer deposition coating is provided over the process facing surface of the component body

Methodology Applied

Scientific EffectAtomic layer deposition: Chemical Vapour Deposition

Data Source

PatentUS20250372351A1Refractory components for a semiconductor processing chamber

Publication Date: 2025.12.04 LAM RES CORP

AI summary

A component for use in a semiconductor processing chamber is provided. A component body has a process facing surface, wherein the component body comprises at least one of iron, iron alloy, nickel, nickel alloy, titanium, and titanium alloy. A coating is over the process facing surface, wherein the coating comprises at least one of a metal oxide, a metal fluoride, and a metal oxyfluoride, wherein the coating is at least 99% by weight pure and has a porosity of less than 0.1%.