An air conditioning system or a heat pump system using refrigerant to cool system electronics and a method for controlling such a system
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Solution Overview
Problem
Air conditioning and heat pump systems face overheating issues due to heat generated by electronics, leading to potential shutdowns or malfunctions, as existing cooling methods are inadequate in managing temperature fluctuations and refrigerant flow efficiently.
Innovation Solution
A system with a temperature sensor controlling the expansion valve based on refrigerant temperature, adjusting the refrigerant flow through heat exchangers to manage the liquid dry out point (LDOP) and superheating, utilizing a cooling apparatus with a cold plate to efficiently transfer heat from electronics to refrigerant, and potentially varying compressor speed with an inverter.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If refrigerant flow through the cooling apparatus is increased to cool electronics, then cooling effectiveness improves, but risk of liquid dry out and superheating increases
Solution Approach 1:
The system employs a temperature sensor to continuously monitor refrigerant temperature and feeds this information back to the electronics module, which automatically adjusts the expansion valve position. This closed-loop feedback mechanism dynamically balances cooling effectiveness with prevention of liquid dry out and superheating, resolving the contradiction between cooling performance and flow stability.
Solution Approach 2:
The expansion valve is dynamically adjusted based on real-time temperature conditions rather than being fixed. The electronics module continuously modifies the valve position to optimize refrigerant flow, allowing the system to adapt to changing thermal conditions and maintain both effective cooling and stable refrigerant flow.
2Productivity
If expansion valve opens wider to increase refrigerant flow, then cooling capacity improves, but liquid dry out point shifts causing superheating
Solution Approach 1:
The temperature sensor provides continuous feedback on refrigerant temperature, allowing the electronics module to monitor the liquid dry out point. When superheating is detected, the system automatically adjusts the expansion valve to restore proper refrigerant flow, preventing temperature control issues while maintaining cooling capacity.
Solution Approach 2:
The system dynamically changes the expansion valve opening parameter based on temperature conditions. By adjusting this critical parameter in response to temperature feedback, the system optimizes the balance between cooling capacity and prevention of liquid dry out, resolving the contradiction between productivity and temperature control.
3Ease of manufacture
If cooling apparatus size is reduced to lower costs, then manufacturing cost decreases, but cooling effectiveness may be insufficient
Solution Approach 1:
Rather than relying on oversized static cooling apparatus, the system uses dynamic control of refrigerant flow through the expansion valve to optimize cooling performance. This allows smaller, more cost-effective cooling components to achieve adequate cooling by precisely controlling refrigerant delivery based on real-time temperature conditions.
Solution Approach 2:
The system optimizes cooling effectiveness through parameter changes in refrigerant flow control rather than increasing apparatus size. By dynamically adjusting the expansion valve opening based on temperature feedback, the system achieves efficient cooling with reduced hardware requirements, lowering manufacturing costs while maintaining effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively manages refrigerant flow and temperature, reducing the risk of overheating, minimizing electronic component failure, and optimizing system performance by maintaining lower temperatures and reducing costs through efficient cooling and reduced size requirements for cooling apparatus.
Implementation Method 1
a cooling apparatus is adjacent the temperature sensor for cooling the module with the low-pressure refrigerant
Implementation Method 2
An expansion valve is disposed between the heat exchangers that converts the high-pressure refrigerant to a low-pressure refrigerant
Implementation Method 3
A temperature sensor detects a temperature of the low-pressure refrigerant passing through the system
Data Source
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AI summary
A system, compressor, and method that cools an electronics module with a low-pressure refrigerant. The system, compressor, and method utilize a temperature sensor that detects a temperature of the low pressure refrigerant and communicates with the electronics module. Based on the temperature detected by the temperature sensor, the electronics module controls a liquid dry out point of the refrigerant that is used to cool the electronics module.