Refrigerant Jacket PCB Layout for Compact Power Device Cooling
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Solution Overview
Problem
The existing refrigeration apparatus with a refrigerant jacket for cooling power devices faces space restrictions due to the large size of the electric component module and refrigerant pipes, which limits the arrangement of other devices within the casing.
Innovation Solution
The refrigeration apparatus incorporates a printed wiring board with a heavy electric component group at the lower part and a light electric component group above, featuring a refrigerant jacket that contacts the power device and a refrigerant pipe extending upwards to the jacket, optimizing the layout to reduce space constraints while maintaining effective cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If electronic components are installed on both front and rear surfaces of a holding member, then the electrical functionality is improved, but the size in the thickness direction increases
Solution Approach 1:
The patent transitions from a planar two-sided component arrangement to a three-dimensional stacked arrangement. Multiple printed circuit boards are stacked in the thickness direction with cooling portions integrated between them, allowing electronic components to be mounted on multiple surfaces while maintaining a compact overall thickness through vertical integration rather than horizontal expansion.
2Temperature
If a refrigerant jacket and refrigerant pipes are disposed in front of the electric component module, then the cooling effectiveness is improved, but the size in the thickness direction increases
Solution Approach 1:
The cooling system is nested within the electric component module structure. Refrigerant jackets and cooling portions are integrated between the stacked printed circuit boards, with cooling portions disposed in spaces between components rather than as separate external additions. This nested arrangement provides effective cooling while minimizing the overall thickness of the assembly.
3Adaptability or versatility
If the printed wiring board is made thicker to accommodate both heavy and light electric components, then the component arrangement flexibility is improved, but the space restrictions inside the casing increase
Solution Approach 1:
The patent segments the electronic components into heavy electric components and light electric components, placing them on different printed circuit boards that are then stacked. This segmentation allows each board to be optimized for its specific component type while the stacked arrangement provides overall flexibility. The cooling system is also segmented into multiple cooling portions corresponding to different board locations, enabling flexible component arrangement without excessive thickness increase.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration minimizes the thickness and length of the printed wiring board, reduces space restrictions within the casing, and enhances workability during maintenance, while ensuring efficient cooling of the power device.
Implementation Method 1
a refrigerant jacket cooling the power device by a refrigerant flowing in a cooling portion which is one portion of a liquid pipe of the refrigerant pipe
Data Source
AI summary
In a refrigeration apparatus, a main surface of a printed wiring board has a heavy electric region, which is a region in the lower part of the printed wiring board where a heavy electric component group is disposed, and a light electric region, which is a region positioned above the heavy electric region, where a light electric component group is disposed. A refrigerant jacket contacts a power device which is disposed in the heavy electric region. A liquid pipe of the refrigerant pipe includes a portion that extends upwards towards the refrigerant jacket, and a cooling portion contacts the refrigerant jacket.