Refrigerant Panel Layout for Compact Phase-Change Heat Dissipation
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Solution Overview
Problem
Existing heat dissipation systems for electronic devices, particularly those using aluminum alloys, face limitations in thermal conductivity, material restrictions, and increased product size, and are challenged by the need for more efficient refrigerants that comply with environmental regulations.
Innovation Solution
An active heat dissipation apparatus utilizing a thermal conduction panel body with a refrigerant flow space formed by bending or joining metal panels, incorporating strength reinforcement portions and using water as a refrigerant, which allows for improved heat dissipation performance and compliance with regulatory standards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If aluminum alloy materials are used for heat dissipation fins, then thermal conductivity is improved, but material restrictions and environmental compliance issues arise
Solution Approach 1:
The patent changes the material parameter from aluminum alloy to stainless steel, and changes the heat dissipation mechanism parameter from pure thermal conduction to phase change heat transfer. This allows the system to achieve effective heat dissipation without being restricted by aluminum alloy material limitations and environmental compliance issues.
Solution Approach 2:
The patent introduces a phase change material (paraffin) that undergoes phase transition from solid to liquid and back, utilizing latent heat of fusion to absorb and release thermal energy. This phase change mechanism enables effective heat dissipation without relying on aluminum alloy's thermal conductivity, thereby resolving material restriction issues.
2Temperature
If the number of heat dissipation fins is increased, then heat dissipation performance is improved, but product size increases
Solution Approach 1:
The patent utilizes the phase change mechanism of paraffin material, which absorbs large amounts of heat during melting and releases heat during solidification. This phase transition process occurs within the enclosed space of the heat dissipation device, providing effective heat dissipation without requiring additional external space for more fins.
Solution Approach 2:
The patent embeds the phase change material within the internal cavity of the heat dissipation device, nesting the heat storage and transfer mechanism inside the existing structure. This allows the heat dissipation function to be integrated within the product's internal volume without increasing external dimensions.
3Temperature
If thermal conduction materials are integrated with the housing, then heat dissipation performance is improved, but manufacturing complexity increases
Solution Approach 1:
The patent divides the heat dissipation system into separate functional modules: the housing structure, the enclosed heat dissipation chamber containing phase change material, and the heat transfer components. This segmentation allows each part to be manufactured independently using standard processes, then assembled together, reducing overall manufacturing complexity compared to integrating thermal conduction materials directly into the housing.
Solution Approach 2:
The patent introduces a heat transfer fluid (phase change material) as an intermediary substance between the heat source and the external environment. This intermediary enables heat dissipation through phase change rather than requiring direct thermal conduction integration between the housing and heat generation elements, simplifying the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus enhances heat dissipation performance by minimizing thermal concentration, maximizing heat transport ability, and reducing manufacturing costs while using environmentally friendly refrigerants.
Implementation Method 1
by means of a phase change of a refrigerant more effective than characteristics of a thermal conduction material
Implementation Method 2
a vaporization zone in which the refrigerant changes from a liquid phase to a gaseous phase
Implementation Method 3
a condensation zone in which the refrigerant changes from a gaseous phase to a liquid phase
Implementation Method 4
characteristics of a thermal conduction material of the active heat dissipation apparatus
Data Source
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AI summary
The present disclosure relates to an active heat dissipation apparatus including a thermal conduction panel body having a refrigerant flow space in which a refrigerant is stored and flows, in which the refrigerant flow space includes a first refrigerant flow path including a press-fitting end positioned adjacent to a press-fitting portion provided on a rear surface portion of a heat dissipation housing main body that is a heat dissipation target, the first refrigerant flow path having upper and lower ends coupled in a gravitational direction or coupled to be inclined with respect to the gravitational direction with respect to the press-fitting portion to define a vaporization zone in which the refrigerant changes from a liquid phase to a gaseous phase, and a plurality of strength reinforcement portions formed in a condensation zone other than the first refrigerant flow path and disposed and spaced apart from one another in a predetermined pattern to guide a flow of a liquid refrigerant condensed in the condensation zone.