Refrigerant Panel Cooling With Absorber for Heat Dissipation Limits
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Solution Overview
Problem
Existing technologies have limitations in efficiently dissipating heat from systems such as antenna apparatuses and electronic devices, particularly in terms of thermal conductivity and manufacturability, which are not addressed in the existing technologies.
Innovation Solution
The implementation of a thermal conduction panel body comprising a thermally conductive material, and forming a refrigerant flow space with a predetermined thickness, which a refrigerant is filled and flows, the thermal conductivity of the refrigerant is formed by a thermal conductivity of the refrigerant flow space, which is used to dissipate the heat from the system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat is dissipated through thermal conductivity of cooling medium material, then heat transfer occurs, but heat dissipation performance is limited by material thermal conductivity
Solution Approach 1:
The patent employs phase change of refrigerant (liquid to vapor and back) as the core heat transfer mechanism. The refrigerant absorbs heat from heat-generating elements through evaporation and releases heat to the external environment through condensation, achieving superior heat dissipation performance that overcomes the thermal conductivity limitations of conventional solid cooling media.
Solution Approach 2:
The patent utilizes a refrigerant fluid circulating through a closed-loop system with evaporator, condenser, and expansion valve components. The hydraulic/pneumatic properties of the refrigerant enable active heat transport throughout the system, allowing heat to be moved from heat-generating regions to dissipation regions more effectively than passive thermal conduction alone.
2Productivity
If the number of transmitters and filters increases to achieve MIMO technology, then data transmission capacity increases, but the number of heat-generating elements increases
Solution Approach 1:
The patent divides the cooling system into multiple independent thermal zones, each with dedicated heat-generating element groups and corresponding refrigerant circulation paths. This segmentation allows each zone to be optimized independently for its specific heat load characteristics while maintaining overall system efficiency.
Solution Approach 2:
The refrigerant-based heat dissipation system serves multiple functions simultaneously: it cools multiple heat-generating elements, transports heat across different thermal zones, and provides adaptive cooling capacity that can respond to varying operational demands of different transmitter and filter components.
3Temperature
If conventional heat dissipation methods are used, then manufacturing is simple, but heat dissipation performance is insufficient
Solution Approach 1:
The patent integrates multiple cooling functions into a unified refrigerant-based system. The thermal conduction panel body, absorber, and refrigerant circulation are combined into a single integrated apparatus that addresses multiple heat dissipation requirements simultaneously, reducing the need for separate cooling components and simplifying overall system architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The implementation of a thermal conductivity of the refrigerant flow space, which is used to dissipate the heat from the system.
Implementation Method 1
capable of improving heat dissipation performance by actively transferring heat generated from a heat-generating device (e.g., an electronic device) through a phase change of a refrigerant
Implementation Method 2
an absorber disposed in the refrigerant flow space and configured to absorb a liquid-phase portion of the refrigerant
Data Source
AI summary
Disclosed herein is an active heat dissipation apparatus including: a thermal conduction panel body formed of a thermally conductive material, and having a refrigerant flow space with a predetermined thickness in which a refrigerant is filled and flows, the thermal conduction panel body including a first thermal conduction panel and a second thermal conduction panel that respectively form first and second surfaces of a thickness portion; joint portions respectively formed on the first and second thermal conduction panels, and configured to join the first and second thermal conduction panels to each other in the refrigerant flow space; and an absorber disposed in the refrigerant flow space and configured to absorb a liquid-phase portion of the refrigerant. The joint portions pass through the absorber in a thickness direction and are joined to each other. The active heat dissipation apparatus provides an advantage of significantly improving heat dissipation performance.