Refrigerant Conduction Panel Layout for Low-Pressure Heat Dissipation
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Solution Overview
Problem
Existing heat dissipation systems for MIMO technology in antenna devices face limitations in thermal conductivity, product size, and cost, with refrigerant-based systems facing issues like increased pressure and restricted refrigerant choices due to environmental regulations.
Innovation Solution
An active heat dissipation apparatus using a thermal conduction panel body with a refrigerant flow space, featuring a first refrigerant flow path and strength reinforcement portions, allows for improved heat dissipation performance and manufacturability, using SUS material and water as a refrigerant.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If aluminum-based thermal conduction materials are used to improve heat dissipation performance, then thermal conductivity is improved, but cost increases and environmental regulations restrict material choices
Solution Approach 1:
The patent changes the physical state of the refrigerant from liquid to supercritical fluid by adjusting pressure and temperature parameters. This allows the use of water (an inexpensive, environmentally friendly material) instead of aluminum-based thermal conduction materials, resolving the contradiction between heat dissipation performance and manufacturing cost/material availability.
Solution Approach 2:
The patent utilizes phase transitions of water between liquid and supercritical fluid states to achieve heat dissipation. By controlling pressure and temperature, water transitions to a supercritical state for efficient heat transfer, then condenses back to liquid, releasing heat. This replaces aluminum-based materials while maintaining or improving heat dissipation performance.
2Temperature
If refrigerant-based heat dissipation systems are used to improve heat dissipation performance, then thermal conductivity is improved, but system pressure increases
Solution Approach 1:
The patent carefully controls the pressure parameter to maintain water in a supercritical state only where and when needed for heat dissipation. By adjusting pressure and temperature parameters, the system achieves efficient heat transfer without excessive pressure buildup, resolving the contradiction between heat dissipation performance and system pressure.
3Temperature
If aluminum-based thermal conduction materials are used, then heat dissipation performance is improved, but thermal concentration occurs in certain areas
Solution Approach 1:
The patent uses phase transitions of water to achieve uniform thermal distribution. As water transitions between liquid and supercritical states, it absorbs and releases heat uniformly throughout the system, preventing thermal concentration in specific areas and resolving the contradiction between heat dissipation performance and thermal distribution uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus enhances heat dissipation performance, reduces manufacturing costs, and complies with environmental regulations by utilizing water as a refrigerant, achieving comparable results to aluminum-based systems while minimizing thermal concentration and pressure issues.
Implementation Method 1
a first refrigerant flow path including a press-fitting end positioned adjacent to a press-fitting portion provided on a rear surface portion of a heat dissipation housing main body that is a heat dissipation target, the first refrigerant flow path having upper and lower ends coupled in a gravitational direction or coupled to be inclined with respect to the gravitational direction with respect to the press-fitting portion to define a vaporization zone in which the refrigerant changes from a liquid phase to a gaseous phase
Implementation Method 2
a plurality of strength reinforcement portions formed in a condensation zone other than the first refrigerant flow path and disposed and spaced apart from one another in a predetermined pattern to guide a flow of a liquid refrigerant condensed in the condensation zone
Data Source
AI summary
The present disclosure relates to an active heat dissipation apparatus including a thermal conduction panel body having a refrigerant flow space in which a refrigerant is stored and flows, in which the refrigerant flow space includes a first refrigerant flow path including a press-fitting end positioned adjacent to a press-fitting portion provided on a rear surface portion of a heat dissipation housing main body that is a heat dissipation target, the first refrigerant flow path having upper and lower ends coupled in a gravitational direction or coupled to be inclined with respect to the gravitational direction with respect to the press-fitting portion to define a vaporization zone in which the refrigerant changes from a liquid phase to a gaseous phase, and a plurality of strength reinforcement portions formed in a condensation zone other than the first refrigerant flow path and disposed and spaced apart from one another in a predetermined pattern to guide a flow of a liquid refrigerant condensed in the condensation zone.