Refrigerant Panel Layout for Housing Heat Dissipation and Water Cooling
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Solution Overview
Problem
Existing heat dissipation systems for electronic devices, particularly those using aluminum alloys, face limitations in thermal conductivity, manufacturability, and compliance with environmental regulations, leading to increased product size, cost, and restricted refrigerant choices, with refrigerant-type systems facing issues of pressure buildup and chemical reactions.
Innovation Solution
An active heat dissipation apparatus utilizing a thermal conduction panel body with a refrigerant flow space formed by bending or joining metal panels, featuring a vaporization zone and condensation zones with strength reinforcement portions, allowing for efficient phase change of refrigerant and using water as a refrigerant to improve heat dissipation performance and reduce manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If aluminum alloy materials are used for heat dissipation fins, then thermal conductivity is improved, but manufacturing cost increases and environmental compliance becomes difficult
Solution Approach 1:
The patent changes the material parameter from aluminum alloy to stainless steel, and changes the heat dissipation mechanism parameter from pure thermal conduction to phase change heat transfer. This allows using lower thermal conductivity material while achieving better heat dissipation through refrigerant phase change, resolving the contradiction between material cost/compliance and heat dissipation performance
Solution Approach 2:
The patent introduces phase transition of refrigerant (evaporation and condensation) as the core heat dissipation mechanism. The refrigerant absorbs heat during evaporation and releases heat during condensation, enabling effective heat dissipation without relying on high thermal conductivity materials, thus resolving the contradiction between material properties and heat dissipation performance
2Ease of manufacture
If refrigerant flow space is formed by bending metal panels, then manufacturing ease is improved, but structural integrity may be compromised
Solution Approach 1:
The patent performs bending and joining operations during the manufacturing process to pre-form the refrigerant flow space and structural reinforcements. By preparing the structure in advance with proper joining at critical locations, the patent maintains structural integrity while achieving manufacturing simplicity through the bending process
3Ease of manufacture
If water is used as refrigerant, then environmental compliance is improved, but chemical reactions and pressure buildup occur
Solution Approach 1:
The patent uses stainless steel material as an intermediary between water refrigerant and the external environment. The stainless steel contains the water, preventing chemical reactions with external substances, and the closed system design manages pressure buildup, enabling the use of environmentally friendly water while maintaining system reliability
4Device complexity
If heat dissipation fins are integrated with housing main body, then device complexity is reduced, but heat dissipation performance becomes insufficient
Solution Approach 1:
The patent merges the heat dissipation function with the housing main body by integrating the refrigerant flow space directly into the housing structure. This combination maintains low device complexity while achieving superior heat dissipation performance through the phase change mechanism, resolving the contradiction between simplicity and effectiveness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus enhances heat dissipation performance, reduces manufacturing costs, and complies with environmental regulations by maximizing heat transport ability and using water as a refrigerant, while maintaining structural integrity and reducing thermal concentration.
Implementation Method 1
a first refrigerant flow path positioned to be adjacent to a press-fitting portion provided on a rear surface portion of a heat dissipation housing main body that is a heat dissipation target, the first refrigerant flow path having a vaporization zone in which the refrigerant changes from a liquid phase to a gaseous phase
Implementation Method 2
a plurality of second refrigerant flow paths provided in a condensation zone provided in a portion other than the first refrigerant flow path and configured to guide a flow of a liquid refrigerant to the vaporization zone
Data Source
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AI summary
The present disclosure relates to an active heat dissipation apparatus including a thermal conduction panel body having a refrigerant flow space in which a refrigerant is stored and flows, the refrigerant flow space being formed in the thermal conduction panel body, in which the refrigerant flow space includes a first refrigerant flow path positioned to be adjacent to a press-fitting portion provided on a rear surface portion of a heat dissipation housing main body that is a heat dissipation target, the first refrigerant flow path having a vaporization zone in which the refrigerant changes from a liquid phase to a gaseous phase, and a plurality of second refrigerant flow paths provided in a condensation zone provided in a portion other than the first refrigerant flow path and configured to guide a flow of a liquid refrigerant to the vaporization zone, and in which the second refrigerant flow paths protrude in the refrigerant flow space and have surfaces that adjoin one another and are in surface contact with one another, and the second refrigerant flow paths form independent flow paths for the liquid refrigerant by a plurality of strength reinforcement portions provided straight and inclined toward the first refrigerant flow path.