Refrigeration Device PCB Layout to Reduce Wiring Complexity and Noise
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Solution Overview
Problem
The complexity of wiring patterns and increased interference noise in refrigeration devices equipped with a refrigerant jacket that uses refrigerant flowing through a refrigerant circuit to cool cooled elements, particularly exacerbated by the concentration of cooled elements and associated harnesses near high-voltage electrical parts.
Innovation Solution
Mounting high-voltage electrical parts, including reactors, directly on the printed wiring board alongside low-voltage components, eliminating the need for connecting harnesses and optimizing the placement of cooled elements in an interleaved power supply circuit to reduce wiring complexity and interference noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If cooled elements are concentrated in the position of the refrigerant jacket for effective cooling, then cooling efficiency is improved, but the wiring pattern becomes complicated and interference noise increases
Solution Approach 1:
The patent merges the reactor with the high-voltage electrical parts group and mounts both on the printed wiring board. This integration eliminates the need for separate harness connections, simplifying the wiring pattern while maintaining the concentration of cooled elements at the refrigerant jacket position for effective cooling
2Ease of manufacture
If a reactor is connected via a harness to simplify wiring pattern, then wiring installation is simplified, but the harness may contact other wires causing increased interference noise
Solution Approach 1:
The reactor is merged with the high-voltage electrical parts group and mounted directly on the printed wiring board, eliminating the need for separate harness connections. This integration removes the source of potential wire contact and interference noise while maintaining ease of manufacture through standardized PCB mounting
3Reliability
If an interleaved power supply circuit is employed for power factor improvement, then power factor is improved, but the number of reactors, diodes, and switching elements increases making wiring pattern more complicated
Solution Approach 1:
The patent integrates multiple reactors, diodes, and switching elements of the interleaved power supply circuit onto a single printed wiring board as a consolidated high-voltage electrical parts group. This merging approach maintains the power factor improvement functionality while simplifying the overall wiring pattern through centralized mounting and elimination of external harness connections
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the wiring pattern, reduces interference noise, decreases the size and cost of the printed wiring board, and enables high-performance part placement while maintaining effective cooling of elements using the refrigerant jacket.
Implementation Method 1
a refrigerant jacket that uses refrigerant flowing through the refrigerant circuit to cool the cooled elements
Data Source
AI summary
A refrigeration device includes a high-voltage electrical parts group having reactors and cooled elements, a low-voltage electrical parts group, a printed wiring board with the electrical parts groups mounted, and a refrigerant jacket that uses refrigerant flowing through the refrigerant circuit to cool the cooled elements. The high-voltage electrical parts group form an interleaved power supply circuit. The cooled elements are placed in an order conforming to a power supply path of the power supply circuit. The power supply circuit has a rectifier circuit, a power factor improvement circuit, smoothing capacitors, and an inverter circuit. The power factor improvement circuit has the reactors connected to each other in parallel and diodes and switching elements serving as the cooled elements connected to each of the reactors. The reactors are placed on an opposite side of the smoothing capacitors, with the diodes and the switching elements sandwiched in between.