Refrigerator Thermosiphon Loop for Power-Failure Cooling Stability

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Solution Overview

Problem

Existing refrigerators face issues with rapid temperature increase in the refrigerating compartment during power failures due to the lack of a cost-effective and reliable mechanism for maintaining cooling cycles, as they require expensive sensors and valves for thermosiphon systems and are prone to soldering malfunctions.

Innovation Solution

A thermosiphon part with a condensation pipe, evaporation pipe, and connection pipes is integrated into the refrigerator, along with a coil heater on the second connection pipe, which allows for continuous heat transfer between compartments using a thermosiphon cycle, eliminating the need for separate sensors and valves, and simplifying the manufacturing process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a thermosiphon system with separate sensors and valves is used to maintain cooling during power failure, then temperature stability is improved, but device complexity and manufacturing cost increase

Engineering Contradiction:
Improvetemperature stabilityVSAvoiddevice complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent integrates the thermosiphon cycle directly into the refrigerant circulation system by forming a closed loop using existing refrigerant pipes. The evaporation pipe, condensation pipe, and connection pipes are welded to create an integrated structure that eliminates the need for separate thermosiphon components, sensors, and valves, thereby maintaining temperature stability during power failures while reducing device complexity

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The refrigerant pipes serve dual functions: they act as both the cooling system components and the thermosiphon cycle components. The evaporation pipe and condensation pipe are formed using the existing refrigerant pipe structure, allowing the same system to perform both normal refrigeration and passive heat transfer during power failures, eliminating the need for dedicated thermosiphon hardware

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Temperature

If a thermosiphon system with separate sensors and valves is used to maintain cooling during power failure, then temperature stability is improved, but manufacturing cost increases

Engineering Contradiction:
Improvetemperature stabilityVSAvoidmanufacturing cost
Core Design Contradiction:
TemperatureVSEase of manufacture

Solution Approach 1:

The patent integrates the thermosiphon cycle directly into the refrigerant circulation system by forming a closed loop using existing refrigerant pipes. The evaporation pipe, condensation pipe, and connection pipes are welded to create an integrated structure that eliminates the need for separate thermosiphon components, sensors, and valves, thereby maintaining temperature stability during power failures while reducing device complexity

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The refrigerant pipes serve dual functions: they act as both the cooling system components and the thermosiphon cycle components. The evaporation pipe and condensation pipe are formed using the existing refrigerant pipe structure, allowing the same system to perform both normal refrigeration and passive heat transfer during power failures, eliminating the need for dedicated thermosiphon hardware

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Ease of manufacture

If soldering process is used to connect thermosiphon components, then assembly is achieved, but reliability decreases due to soldering failure

Engineering Contradiction:
ImproveassemblyVSAvoidreliability
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent replaces the soldering connection method with a welding process for connecting the evaporation pipe, condensation pipe, and connection pipes. The welding creates stronger, more reliable joints that are resistant to thermal stress and vibration, eliminating the soldering failures that plague traditional thermosiphon implementations while maintaining manufacturing feasibility

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively minimizes the rapid increase in temperature of the refrigerating compartment during power failures by utilizing a thermosiphon cycle and coil heater, reducing product costs and preventing soldering failures, while maintaining temperature stability without the need for additional control devices.

Implementation Method 1

a thermosiphon part with a condensation pipe, evaporation pipe, and connection pipes is integrated into the refrigerator, along with a coil heater on the second connection pipe, which allows for continuous heat transfer between compartments using a thermosiphon cycle

Methodology Applied
Scientific EffectThermosiphon cycle: Thermosyphon

Implementation Method 2

a condensation pipe for condensing the working fluid by cool air of the freezing compartment, an evaporation pipe for absorbing heat from cool air of the refrigerating compartment and evaporating the working fluid

Methodology Applied
Scientific EffectPhase change: Phase Change

Implementation Method 3

The heating member may include a coil heater provided to surround an outer circumferential surface of the second connection pipe

Methodology Applied
Scientific EffectJoule heating: Joule Heating

Data Source

PatentEP3193108B1refrigerator
Publication Date: 2019.03.06 LG ELECTRONICS INC
  • EP3193108B1 patent drawingFigure 1
  • EP3193108B1 patent drawingFigure 2
  • EP3193108B1 patent drawingFigure 3

AI summary

A refrigerator (1) comprising, a main body (10) comprising a freezer compartment (11) and a refrigeration compartment (12); and a heat transfer module (20) comprising a thermosiphon part having a first portion disposed in the freezer compartment (11) and a second portion disposed in the refrigeration compartment (12) , and a heating member (30) attached to a side of the thermosiphon part; wherein the heat transfer module (20) comprises a closed loop in which working fluid for transferring heat flows and is heated by the heating member (30).