Region-Selective Surface Treatment for ALD Film Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current methods for forming films on substrates using the atomic layer deposition (ALD) method lack the ability to selectively modify substrate surfaces with different materials, leading to inadequate control over film thickness and step coverage, especially in semiconductor manufacturing where higher integration and miniaturization demands precise surface treatment.
Innovation Solution
A surface treatment method involving a silylation agent and a nitrogen-containing heterocyclic compound is used to modify substrate surfaces, allowing for region-selective hydrophobicity and differing contact angles, enabling selective film formation with the ALD method by controlling the deposition amount of film materials based on the treated regions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional ALD method is used for film formation, then film thickness control at atomic layer level is achieved, but region-selective film formation on substrates with multiple material regions is not possible
Solution Approach 1:
The patent applies local quality by treating different regions of the substrate surface with different materials (organic and inorganic) to create distinct surface properties. The silylation treatment selectively modifies specific regions based on their material composition, enabling region-selective film formation while maintaining atomic layer-level thickness control through the ALD process.
Solution Approach 2:
The patent employs preliminary action by performing silylation treatment on the substrate surface before the ALD film formation process. This pre-treatment modifies the surface chemistry of different regions, creating differential wettability and reactivity that enables selective film deposition in subsequent ALD steps.
2Manufacturing precision
If the substrate surface is treated to enhance hydrophobicity, then contact angle increases and film deposition selectivity improves, but the treatment must be applied selectively to different material regions
Solution Approach 1:
The patent implements local quality by using different silylation agents or treatment conditions for different material regions (organic vs. inorganic). This creates region-specific hydrophobicity levels, allowing precise contact angle control on each region type while maintaining a relatively simple overall process flow.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for precise control of film thickness and step coverage, enhancing the selective formation of films on substrates with varying regions, improving the refinement of patterns and hydrophobicity, and is suitable for semiconductor manufacturing.
Implementation Method 1
a reaction between the silylation agent and the two or more regions causes contact angles of water to differ from each other with respect to adjacent regions in the two or more regions
Implementation Method 2
exposing the surface to a surface treatment agent including a silylation agent (A) and a nitrogen-containing heterocyclic compound (B)
Implementation Method 3
forming a film on the surface of the substrate that has been surface-treated by an atomic layer deposition method
Data Source
AI summary
A surface treatment method for a substrate surface; a surface treatment agent used for the surface treatment method; and a method for forming a film on a substrate in a region-selective manner. The method includes exposing the surface to a surface treatment agent including a silylation agent and a nitrogen-containing heterocyclic compound, the surface including two or more regions, adjacent regions in the two or more regions having different materials, and a reaction between the silylation agent and the two or more regions causing contact angles of water to differ from each other with respect to adjacent regions in the two or more regions.