Regular Via Pattern for Sensor Input Device
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing input devices, such as proximity sensor devices, face challenges in efficiently detecting input objects due to complex patterns of sensor electrodes and routing traces, which can lead to manufacturing difficulties and reduced reliability.
Innovation Solution
The implementation of a regular pattern of vias that connect sensor electrodes with routing traces, allowing for simpler visual inspection and increased uniformity, thereby enhancing the reliability and customization of input devices for specific processing systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If complex patterns of sensor electrodes and routing traces are used, then detection capability is improved, but manufacturing difficulty increases and reliability decreases
Solution Approach 1:
The patent segments the sensor electrode pattern into multiple discrete sensor electrodes arranged in a grid, where each electrode can be independently connected to routing traces through vias. This segmentation allows for simpler manufacturing of individual components while maintaining overall detection capability through the collective array of electrodes.
Solution Approach 2:
The patent introduces vias as intermediary elements that connect the sensor electrodes in the first layer to the routing traces in the second layer. These vias serve as mediators that simplify the connection process and reduce manufacturing complexity by providing standardized connection points rather than requiring direct complex trace routing.
2Measurement precision
If complex patterns of sensor electrodes and routing traces are used, then detection capability is improved, but reliability decreases
Solution Approach 1:
By segmenting the electrode pattern into discrete, regularly spaced sensor electrodes with standardized via connections, the patent reduces variability in the electrical connections. This segmentation approach improves reliability by ensuring consistent connection points and reducing the complexity of trace routing that could lead to manufacturing defects.
Solution Approach 2:
The patent employs a regular pattern of sensor electrodes and vias that creates homogeneous structures throughout the sensing region. This homogeneity ensures uniform electrical properties and consistent detection performance across the entire device, improving reliability by eliminating variations that could arise from irregular patterns.
3Ease of manufacture
If regular pattern of vias is implemented, then manufacturing simplicity and uniformity are improved, but connection density may be reduced
Solution Approach 1:
The patent resolves the connection density issue by transitioning to a two-dimensional grid array of sensor electrodes, where multiple electrodes can be arranged in parallel. This dimensional approach allows the regular via pattern to connect to multiple routing traces simultaneously, maintaining connection density while preserving manufacturing simplicity through the regular pattern.
Data Source
AI summary
This disclosure generally describes an input device, a display device having an integrated capacitive sensing device, and an assembly for an input device. The input device comprises a plurality of sensor electrodes disposed in a first layer, and a processing system configured to detect presence of input objects in a sensing region defined proximate to the plurality of sensor electrodes. The input device further comprises a plurality of routing traces disposed in a second layer and coupled with the processing system, and a plurality of vias arranged in a regular pattern within an areal extent of the sensing region, wherein at least a portion of the plurality of vias couple the plurality of sensor electrodes with the plurality of routing traces.