Reinforced Assembly Carrier Edge Frame
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Solution Overview
Problem
Conventional assembly carriers, due to their thinness, are prone to bending, jamming, and warpage during miniaturization, which affects their reliability and yield in semiconductor packaging processes.
Innovation Solution
A reinforced assembly carrier is created by forming a supporting frame made of molding compound on the edge areas using a molding process, enhancing mechanical strength and preventing deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the assembly carrier is made thinner for miniaturization, then the size is reduced, but the mechanical strength decreases causing bending and jamming
Solution Approach 1:
The assembly carrier combines the thin carrier substrate with a supporting frame made of molding compound to create a composite structure. This allows the carrier to maintain thinness for miniaturization while the added frame material provides the necessary mechanical strength to prevent bending and jamming during handling and processing.
Solution Approach 2:
The supporting frame is segmented into multiple sections positioned at specific locations on the assembly carrier. This segmentation allows the frame to provide localized reinforcement where needed most (at edges and corners prone to bending) while minimizing the overall addition to the carrier's size and complexity.
2Volume of moving object
If the assembly carrier is made thinner for miniaturization, then the size is reduced, but the assembly carrier becomes prone to warpage during heating
Solution Approach 1:
The composite structure of the thin carrier combined with the supporting frame creates a more thermally stable assembly. The frame acts as a thermal anchor that resists warpage during heating processes like die-bonding and wire-bonding, while the thin carrier maintains its miniaturized form factor.
Solution Approach 2:
The supporting frame adds a third-dimensional reinforcement element to the thin two-dimensional carrier. This vertical reinforcement structure provides dimensional stability during thermal processing without significantly increasing the carrier's footprint area, thus maintaining miniaturization benefits.
3Strength
If a supporting frame is added to enhance mechanical strength, then the strength is improved, but the device complexity increases
Solution Approach 1:
The supporting frame is merged with the carrier in a single integrated structure formed by the molding compound. This combining of the reinforcement element with the carrier substrate reduces the number of separate components and assembly steps, thereby reducing overall device complexity despite the added structural reinforcement.
Solution Approach 2:
The supporting frame serves multiple functions simultaneously: it provides mechanical strength to prevent bending, stabilizes the carrier during thermal processing to prevent warpage, and maintains the miniaturized form factor. This multi-functionality reduces the need for additional separate components, thereby reducing overall structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The reinforced assembly carrier effectively prevents jamming and warpage, improving mechanical properties and ensuring reliable semiconductor package production without occupying the central area for subsequent processes.
Implementation Method 1
A supporting frame made of sealant, such as molding compound is formed on the edge area of the upper surface and/or on the edge area of the lower surface of the assembly carrier with a molding process
Data Source
AI summary
A reinforced assembly carrier is provided. A supporting frame made of molding compound is formed on the edge area of the upper surface and/or on the edge area of the lower surface of the assembly carrier thereby enhancing the mechanical strength of the assembly carrier.