Reinforced Encapsulation Package for Housing-Free Smartwatch Integration
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Solution Overview
Problem
The integration of additional electronic components in smartwatches, such as GPS and heart rate sensing modules, increases the size and weight of the housing, negatively impacting user experience.
Innovation Solution
A semiconductor device package with a reinforced structure surrounded by an encapsulation layer, which eliminates the need for a housing by distributing electronic components, including a power device, electronic component, and display device, within the encapsulation layer, providing protection and miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If additional electronic components (GPS module, heart rate sensing module) are integrated into the housing, then the functionality of the smartwatch is improved, but the size and weight of the housing increase
Solution Approach 1:
The patent merges multiple electronic components (display device, power device, sensors, antennas) into a single integrated semiconductor device package. The components are disposed in direct contact with each other within a unified encapsulation structure, eliminating the need for a separate housing and reducing overall device size and weight while maintaining full functionality.
Solution Approach 2:
The patent implements a nested arrangement where electronic components are stacked and disposed in direct contact within a compact three-dimensional configuration. The display device, power device, sensors, and antennas are nested within the encapsulation layer, maximizing space utilization and minimizing the external dimensions of the package.
2Adaptability or versatility
If additional electronic components are integrated into the housing, then the functionality of the smartwatch is improved, but the size of the housing increases
Solution Approach 1:
The patent merges multiple electronic components (display device, power device, sensors, antennas) into a single integrated semiconductor device package. The components are disposed in direct contact with each other within a unified encapsulation structure, eliminating the need for a separate housing and reducing overall device size and weight while maintaining full functionality.
Solution Approach 2:
The patent transitions from a two-dimensional planar arrangement to a three-dimensional stacked configuration. Electronic components are disposed in direct contact in multiple layers and orientations within the encapsulation package, utilizing vertical space to reduce the footprint area while accommodating all necessary functional components.
3Reliability
If a housing is used to accommodate electronic components, then the components are protected, but the size and weight of the device increase
Solution Approach 1:
The patent extracts the housing function from the traditional watch structure and replaces it with a compact semiconductor device package. The encapsulation layer provides necessary protection for the electronic components without requiring a separate metal or plastic housing, thereby reducing overall device weight while maintaining component protection.
Solution Approach 2:
The patent uses a thin encapsulation layer to protect the electronic components instead of a bulky housing. The encapsulation package provides a compact, lightweight protective structure that surrounds and protects the stacked electronic components while minimizing added weight and volume.
4Reliability
If a housing is used to accommodate electronic components, then the components are protected, but the size of the device increases
Solution Approach 1:
The patent extracts the housing function from the traditional watch structure and replaces it with a compact semiconductor device package. The encapsulation layer provides necessary protection for the electronic components without requiring a separate metal or plastic housing, thereby reducing overall device weight while maintaining component protection.
Solution Approach 2:
The patent implements a nested arrangement where electronic components are stacked and disposed in direct contact within a compact three-dimensional configuration. The display device, power device, sensors, and antennas are nested within the encapsulation layer, maximizing space utilization and minimizing the external dimensions of the package.
Data Source
AI summary
A semiconductor device package includes a display device, an encapsulation layer disposed in direct contact with the display device, and a reinforced structure surrounded by the encapsulation layer. The reinforced structure is spaced apart from a surface of the display device. A method of manufacturing a semiconductor device package is also disclosed.