Reinforced Enclosure With Internal Frame For Thin Profile Stiffness
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Solution Overview
Problem
Conventional computer enclosures are inadequate in varying stiffness across different regions, leading to insufficient structural integrity and resiliency, especially as portable devices become thinner, necessitating a solution to enhance the strength and stiffness of these enclosures while maintaining a thin profile.
Innovation Solution
The implementation of an internal frame with an array of structural members arranged in a pattern, reinforced with high-tensile strength fibers woven or wound around the members, encased within a plastic material injected into a mold to form a reinforced enclosure that can selectively vary stiffness and improve resiliency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If conventional injection molded materials are used for thin-profile computer housings, then the device can maintain a thin form factor, but the structural stiffness and integrity are insufficient
Solution Approach 1:
The patent combines multiple materials with complementary properties: a thin-walled injection molded plastic enclosure provides the thin profile, while an internal frame made of rigid material (metal or rigid plastic) provides structural stiffness. The composite structure allows the thin exterior to maintain form factor while the internal rigid frame provides the necessary strength and stiffness that conventional single-material enclosures cannot achieve.
2Length of moving object
If the enclosure is made thinner to meet portable device requirements, then the device portability is improved, but the resiliency against damage decreases
Solution Approach 1:
The thin-walled plastic enclosure combined with the internal rigid frame creates a composite structure where the thin plastic shell provides protection and aesthetics while the internal rigid frame provides the primary structural strength and damage resistance. This allows the device to maintain a thin portable form factor while the reinforced internal structure provides the resiliency needed to protect internal components from damage.
3Strength
If uniform structural stiffness is increased throughout the enclosure, then the overall integrity is improved, but the thin wall form factor cannot be maintained
Solution Approach 1:
Instead of uniformly thickening the entire enclosure, the patent places rigid structural members (internal frame) only in specific locations where strength and stiffness are most needed, such as around the perimeter and at key structural points. This localized reinforcement allows the majority of the enclosure walls to remain thin, maintaining the thin wall form factor while providing enhanced structural integrity where it matters most.
Solution Approach 2:
The combination of thin-walled plastic with strategically placed rigid internal framing creates a composite structure that achieves high structural stiffness at critical locations without requiring uniform thickness throughout. The thin plastic walls provide form and basic protection, while the rigid frame members provide the concentrated stiffness needed for structural integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for enhanced structural stiffness in specific regions while maintaining a thin profile, improving the device's resistance to damage and overall structural integrity.
Implementation Method 1
forming an outer shell of the enclosure by injecting a plastic material into a mold to thereby encase the internal frame in the plastic material
Data Source
AI summary
In accordance with aspects of the disclosure, a device may include a base member formed as a receptacle with a recess defining an interior region configured for receiving internal circuitry. The base member may include first and second sides intersecting orthogonally to define a corner. The device may include a rail member having a first portion coupled to the first side of the base member and a second portion coupled to the second side of the base member. The rail member may be positioned to contact the corner of the base member. The device may include an enclosing member coupled to the first and second portions of the rail member with a plurality of fasteners to thereby enclose the internal circuitry disposed in the recess of the base member between the enclosing member and the base member.