Reinforced Insulating Substrate for Low Profile Electronic Device Mounting
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Solution Overview
Problem
Conventional image taking apparatuses for portable devices face challenges in reducing profile thickness, leading to stress concentration and potential cracking of the insulating base substrate due to the thinness of the substrate.
Innovation Solution
An electronic device mounting board with an insulating substrate featuring a reinforcement portion around the opening, which distributes stress and prevents deformation and cracking when an electronic device is mounted, allowing for a lower profile design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the thickness of the insulating base substrate is reduced to make the image taking apparatus lower in profile, then the profile height is reduced, but the substrate becomes susceptible to deformation and cracking under stress
Solution Approach 1:
The patent introduces a reinforcement substrate made of a material different from the insulating base substrate (such as a metal plate or ceramic plate) and bonds it to the insulating base substrate. This composite structure combines the thin profile capability of the insulating substrate with the high strength and stress resistance of the reinforcement substrate, allowing the apparatus to maintain both low profile height and sufficient substrate strength.
Solution Approach 2:
The reinforcement substrate is positioned within the overall structure of the image taking apparatus, nested between the insulating base substrate and the support plate. This nested arrangement allows the reinforcement substrate to provide structural support without increasing the external dimensions of the apparatus, thereby maintaining the low profile while preventing substrate deformation and cracking.
2Length of stationary object
If the thickness of the insulating base substrate is reduced, then the profile height is reduced, but stress concentration occurs around the opening leading to cracks
Solution Approach 1:
The reinforcement substrate made of high-strength material (metal or ceramic) is bonded to the insulating base substrate to create a composite structure. This composite structure distributes the stress around the opening across both substrates, preventing stress concentration in the thin insulating substrate and thereby preventing cracks while maintaining the reduced profile height.
3Length of stationary object
If the thickness of the insulating base substrate is reduced, then the profile height is reduced, but deformation occurs under stress during device mounting
Solution Approach 1:
The reinforcement substrate with high mechanical strength is bonded to the insulating base substrate to form a composite structure. This composite structure provides sufficient rigidity and stability to prevent deformation during device mounting while allowing the insulating substrate to maintain its thin profile, thus achieving both low height and high stability.
Solution Approach 2:
The reinforcement substrate is nested within the layered structure of the image taking apparatus, positioned between the insulating base substrate and the support plate. This nested configuration provides internal structural support that prevents deformation during mounting operations without increasing the external profile height of the apparatus.
Data Source
AI summary
There are provided an electronic device mounting board and an electronic apparatus that can be made lower in profile. An electronic device mounting board includes an insulating substrate having an opening in which an electronic device is disposed so as to lie over the opening as seen in a transparent plan view, and a reinforcement portion disposed on a surface or in an interior of the insulating substrate so as to lie around the opening of the insulating substrate as seen in a transparent plan view.