Reinforced Power Semiconductor Module Base Plate for Stable Heat Dissipation
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Solution Overview
Problem
Conventional power semiconductor module arrangements face issues with reduced pressure due to deformation of soft metal base plates over time, leading to inadequate heat dissipation and performance degradation.
Innovation Solution
An integrated base plate with a ceramic substrate sandwiched between two metallic layers, including a reinforcing layer for increased strength, and a housing with mounting elements and screws that distribute pressure evenly to maintain contact with the mounting surface, reducing creep and enhancing heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a soft metal base plate is used to integrate the substrate, then ease of manufacture and bonding is improved, but the base plate deforms over time under pressure leading to reduced contact pressure and reliability
Solution Approach 1:
The base plate is constructed as a composite structure combining a soft metal layer (for ease of bonding and manufacturing) with a reinforcing layer of higher strength material (to prevent deformation and maintain reliability under prolonged pressure). This composite construction allows the soft metal to provide bonding advantages while the reinforcing layer prevents the deformation that would otherwise occur over time.
2Strength
If screws are used to press the housing on the base plate, then secure attachment is achieved, but the soft metal base plate deforms under the concentrated pressure leading to decreased contact pressure over time
Solution Approach 1:
The reinforcing layer is pre-installed within the soft metal base plate before the housing is attached. This preliminary reinforcement ensures that when screw pressure is applied, the force is distributed through the reinforcing layer, preventing the soft metal from deforming under the concentrated screw loads and maintaining consistent contact pressure with the mounting surface.
3Temperature
If pressure is exerted on the base plate to ensure good contact with the mounting surface, then heat dissipation is improved, but the soft metal deforms leading to reduced pressure and contact quality over time
Solution Approach 1:
The composite base plate structure with the reinforcing layer maintains structural stability under prolonged pressure, ensuring that the contact pressure with the mounting surface remains consistent over time. This stable pressure distribution ensures continuous effective thermal contact with the mounting surface for reliable heat dissipation without the soft metal deforming and losing contact pressure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively maintains consistent pressure and improves heat dissipation by distributing the force over a larger contact area, reducing the likelihood of creep and enhancing the overall performance and reliability of the power semiconductor module.
Implementation Method 1
a ceramic substrate bonded directly to a first surface of the first metallic layer... the housing is pressed on the first metallic layer
Implementation Method 2
the head of each of the plurality of screws exerts pressure on one of the plurality of mounting elements in a vertical direction towards the mounting surface
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
A power semiconductor module arrangement (200) comprises an integrated base plate (90) arranged on a mounting surface (82) and comprising a first metallic layer (902), a ceramic substrate (906) bonded directly to a first surface of the first metallic layer (902), a second metallic layer (908) bonded directly to the ceramic substrate (906) such that the ceramic substrate (906) is arranged between the first metallic layer (902) and the second metallic layer (908), and a reinforcing layer (904) embedded in the metallic layer (902) and having a greater strength than the first metallic layer (902), a housing (7) arranged on the first metallic layer (902) of the integrated base plate (90), a plurality of mounting elements (952), and a plurality of screws (950), each of the plurality of screws (950) comprising a shaft and a head, wherein the shaft of each of the plurality of screws (950) extends through a threaded hole in one of the plurality of mounting elements (952) and into a threaded hole in the mounting surface (82), the head of each of the plurality of screws (950) exerts pressure on one of the plurality of mounting elements (952) in a vertical direction (y) towards the mounting surface (82), each of the plurality of mounting elements (952) is attached to or monolithically formed with the housing (7), and the plurality of mounting elements (952) are configured to transfer the pressure exerted on the mounting elements (952) by means of the screws (950) to the housing (7) such that the housing (7) is pressed on the first metallic layer (902).