Reinforced Redistribution Package Structure Against Dicing Cracks
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Solution Overview
Problem
The semiconductor industry faces challenges in miniaturization, higher speed, greater bandwidth, lower power consumption, and latency due to limitations in packaging techniques, particularly in preventing crack and delamination issues during the de-bonding and dicing processes of semiconductor dies.
Innovation Solution
The implementation of a reinforcement structure embedded within the redistribution circuit structure, which includes conductive pattern layers and vias, enhances structural rigidity by acting as a blocking mechanism against bending stress and cutting stress, thereby alleviating crack and delamination issues during de-bonding and dicing processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If the semiconductor die size is reduced for miniaturization, then the integration density improves, but the structural rigidity decreases making the die more susceptible to crack and delamination during de-bonding and dicing processes
Solution Approach 1:
The patent employs a composite structure consisting of the semiconductor die bonded to a carrier substrate, forming a composite package structure. This composite construction provides the small die with additional structural support and rigidity from the carrier, preventing crack and delamination issues during processing while maintaining the miniaturization benefits.
Solution Approach 2:
The patent performs bonding of the semiconductor die to the carrier substrate before the de-bonding and dicing processes. This preliminary bonding action creates a reinforced structure that can withstand subsequent processing stresses, preventing crack and delamination that would occur in standalone small dies.
2Stability of the object's composition
If the carrier bonding process is performed, then the structural stability improves, but the de-bonding process generates bending stress that can cause crack and delamination
Solution Approach 1:
The patent introduces a reinforcement structure embedded within the carrier substrate that acts as a cushioning element during the de-bonding process. This reinforcement structure absorbs and distributes the bending stress generated during de-bonding, preventing crack and delamination while allowing the bonding process to proceed.
Solution Approach 2:
The patent implements a reinforcement structure with specific local properties (higher rigidity and strength) embedded within the carrier substrate at critical locations. This localized reinforcement provides targeted protection against bending stress during de-bonding without affecting the overall bonding stability.
3Productivity
If the dicing process is performed to separate semiconductor dies, then the productivity improves, but the cutting stress causes crack and delamination at the edges of the semiconductor die
Solution Approach 1:
The patent introduces a reinforcement structure embedded within the carrier substrate that acts as a cushioning element during the dicing process. This reinforcement structure absorbs and distributes the cutting stress generated during dicing, preventing crack and delamination while allowing efficient die separation.
Solution Approach 2:
The patent implements a reinforcement structure with specific local properties (higher rigidity and strength) embedded within the carrier substrate at critical locations. This localized reinforcement provides targeted protection against cutting stress during dicing without affecting the overall dicing efficiency.
4Strength
If a reinforcement structure is embedded within the carrier, then the resistance to bending stress and cutting stress improves, but the device complexity increases
Solution Approach 1:
The patent embeds the reinforcement structure within the carrier substrate, creating a nested structure where the reinforcement is contained inside the carrier. This nesting approach provides stress resistance functionality while maintaining a compact overall structure and avoiding excessive complexity.
Solution Approach 2:
The reinforcement structure serves multiple functions: it provides resistance to bending stress during de-bonding, resistance to cutting stress during dicing, and maintains structural stability. This multi-functionality reduces the need for separate components, thereby limiting the increase in device complexity.
Data Source
AI summary
A package structure includes a redistribution circuit structure, a wiring substrate, an insulating encapsulation, and a reinforcement structure. The redistribution circuit structure has dielectric layers. The wiring substrate is disposed on the redistribution circuit structure. The insulating encapsulation laterally encapsulates the wiring substrate. The reinforcement structure includes reinforcement pattern layers and reinforcement vias. The reinforcement pattern layers and the dielectric layers are stacked alternately. The reinforcement vias penetrate through the dielectric layers to connect the reinforcement pattern layers. At least one of the reinforcement pattern layers is embedded in the insulating encapsulation. The reinforcement structure is electrically floating.