Reinforced Electronic Package Structure for Warpage Reduction
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Solution Overview
Problem
Conventional semiconductor packages face warpage issues due to increasing dimensions, necessitating an effective solution to enhance structural strength and rigidity.
Innovation Solution
Incorporation of a reinforcement member with higher hardness and tunable coefficient of thermal expansion (CTE) within the electronic package, along with conductive pillars and an encapsulation layer, to improve structural rigidity and reduce warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the dimension of the semiconductor package is increased, then the packaging capacity is improved, but warpage problems occur
Solution Approach 1:
The patent introduces a reinforcement member with specifically controlled material parameters, particularly the coefficient of thermal expansion (CTE) matching the encapsulation colloid, and adjusts the hardness ratio between the reinforcement member and encapsulation colloid to resolve the warpage issue in large-scale packages
Solution Approach 2:
The patent employs a composite structure combining the reinforcement member made of materials such as glass bulk, metal bulk, or dummy die with the encapsulation colloid, creating a composite packaging structure that enhances overall structural stability while accommodating larger dimensions
2Volume of moving object
If the dimension of the semiconductor package is increased, then the packaging capacity is improved, but rigidity deteriorates
Solution Approach 1:
The patent specifies that the reinforcement member should have a hardness value of 50-100 Shore D while the encapsulation colloid has a hardness of 10-40 Shore D, creating an optimal hardness ratio that enhances rigidity in large-scale packages without compromising packaging capacity
Solution Approach 2:
The reinforcement member is strategically positioned within the encapsulation colloid at specific locations where structural support is most needed, providing localized rigidity enhancement rather than uniformly increasing the entire package structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The reinforcement member enhances the strength and rigidity of the package structure, reducing warpage and facilitating advanced packaging technology development.
Implementation Method 1
The reinforcement member has a tunable coefficient of thermal expansion (CTE)
Implementation Method 2
The hardness of the reinforcement member is higher than that of the encapsulation layer
Data Source
AI summary
An electronic package and a manufacturing method thereof are provided. The electronic package at least includes an electronic element, a conductive pillar, a reinforcement member, an encapsulation layer and a redistribution layer. The conductive pillar and the reinforcement member are both disposed around the electronic element. The electronic element, the conductive pillar and the reinforcement member are encapsulating by the encapsulation layer. The redistribution layer is disposed on the same side of the electronic element, the conductive pillar, the reinforcement member and the encapsulation layer, and electrically connected to the electronic element and the conductive pillar. The reinforcement member has high hardness and a tunable coefficient of thermal expansion (CTE), which can enhance the strength and rigidity of the electronic package to reduce the warpage of the electronic package.