Reinforced PCB Layer Structure for Warpage and Bending Control
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Solution Overview
Problem
The increasing size and complexity of multilayer substrates in electronic devices, particularly due to the rise in CPU and GPU cores, lead to warpage and bending issues, which affect the reliability and mounting of various electronic components.
Innovation Solution
A printed circuit board design featuring a reinforcing layer with higher stiffness than insulating layers, along with different thicknesses and cavities, allows for improved control of warpage and bending characteristics, enabling the mounting of diverse electronic components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the substrate size is increased to accommodate more CPU and GPU cores, then the processing capability is improved, but warpage and bending issues occur
Solution Approach 1:
The substrate is divided into multiple layers including first and second insulating layers, a reinforcing layer, and cavities. This segmentation allows each layer to serve specific functions - insulating layers for electrical isolation, reinforcing layer for structural stability, and cavities for stress relief - thereby maintaining substrate stability while accommodating increased processing capability
Solution Approach 2:
The substrate employs a composite structure combining different materials with distinct properties: insulating materials for electrical isolation, reinforcing materials for mechanical strength, and cavity structures for stress management. This composite approach enables the substrate to simultaneously achieve high processing capability through increased size while maintaining stability through differentiated material properties
2Adaptability or versatility
If various electronic components are mounted on the substrate, then functionality is improved, but warpage control becomes difficult
Solution Approach 1:
The substrate implements local quality variations through cavities positioned at specific locations and insulating layers with different thicknesses in different regions. These localized structural differences allow the substrate to accommodate various electronic components with different mounting requirements while maintaining overall warpage control through strategic placement of reinforcing and insulating structures
3Area of stationary object
If the substrate size increases, then more components can be mounted, but bending characteristics deteriorate
Solution Approach 1:
The substrate transitions from a simple planar structure to a three-dimensional multilayer architecture with cavities extending through different depths. This dimensional complexity allows the substrate to span larger areas while maintaining bending resistance through vertical reinforcement structures and layered construction that distributes mechanical stresses across multiple dimensions
Data Source
AI summary
The present disclosure relates to a printed circuit board, the printed circuit board including: a reinforcing layer; a first insulating layer disposed above the reinforcing layer; a second insulating layer disposed below the reinforcing layer; a first cavity penetrating at least a portion of the first insulating layer; a second cavity penetrating at least a portion of the second insulating layer; a first electronic component disposed within the first cavity; and a second electronic component disposed within the second cavity. The reinforcing layer has a higher degree of stiffness than that of the first insulating layer, and the first insulating layer and the second insulating layer have substantially different thicknesses.