Reinforced Sealing Resin Structure for Semiconductor Modules
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Solution Overview
Problem
Conventional semiconductor modules face issues with fracture in the sealing resin, which compromises the protection of semiconductor chips and reduces reliability due to deformation from heat or other factors, leading to potential breakdown voltage failures.
Innovation Solution
Incorporating a reinforcing material with a higher Young's modulus than the sealing resin, positioned in close contact with the sealing resin, to suppress deformation and fracture, thereby enhancing the module's structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If sealing resin is used to protect semiconductor chips and circuit board, then protection function is provided, but fracture occurs in the sealing resin due to heat deformation
Solution Approach 1:
The patent applies composite materials by combining sealing resin with a reinforcing material (such as a metal plate or ceramic plate) to create a hybrid structure. The reinforcing material has higher mechanical strength and thermal stability than the sealing resin alone, preventing fracture while maintaining the protection function. This directly resolves the contradiction by integrating two materials with complementary properties.
2Reliability
If sealing resin is used to seal semiconductor components, then sealing function is achieved, but deformation occurs under heat conditions
Solution Approach 1:
The composite structure of sealing resin combined with a thermally stable reinforcing material (metal or ceramic plate) provides dimensional stability under heat. The reinforcing material has low thermal expansion and high thermal stability, counteracting the deformation tendency of the sealing resin, thus maintaining both sealing function and dimensional stability.
Solution Approach 2:
The patent changes the physical and thermal parameters of the sealing structure by introducing a reinforcing material with superior thermal properties. This modifies the overall thermal expansion coefficient and heat resistance of the sealing system, enabling it to maintain dimensional stability under elevated temperatures while preserving the sealing function.
3Strength
If reinforcing material is added to sealing resin, then fracture is suppressed, but device complexity increases
Solution Approach 1:
The patent implements a composite material structure where a reinforcing material (metal or ceramic plate) is integrated with the sealing resin. This combination enhances fracture resistance while maintaining a relatively simple overall structure, as the reinforcing material is positioned as a single layer within the sealing resin rather than adding multiple complex components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The reinforcing material effectively reduces the likelihood of sealing resin fracture, maintaining the protection of semiconductor chips and improving the reliability of the semiconductor module by preventing deformation and breakdowns.
Implementation Method 1
The reinforcing material may have a higher Young's modulus than the sealing resin
Data Source
AI summary
Provided is a semiconductor module, including: a semiconductor chip; a circuit board on which the semiconductor chip is mounted; a sealing resin including epoxy resin for sealing the semiconductor chip and the circuit board; and a reinforcing material, with a higher Young's modulus than the sealing resin, provided in close contact with the sealing resin above at least a part of the sealing resin. The semiconductor module includes a resin case for enclosing spaces for housing the semiconductor chip, wherein the sealing resin may be provided inside the resin case.