Reinforced Unit Chip Layout for Backside Power Delivery
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Solution Overview
Problem
Backside power design for electronic devices requires thinning of the silicon substrate, increasing process constraints and complicating the integration of power and signal paths.
Innovation Solution
The electronic device incorporates a unit chip with a power delivery circuit and a reinforcement structure that includes a thermosetting or glass reinforcement, allowing for efficient power signal transmission and structural support without the need for substrate thinning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If backside power design is implemented to deliver power through the backside of devices, then the need to share interconnect resources between signal and power lines is eliminated, but the silicon substrate requires thinning which increases process constraints
Solution Approach 1:
The patent transitions from front-side power delivery to backside power delivery, utilizing the third dimension (substrate thickness) to separate power and signal paths. Power signals are routed through the backside of the substrate via through-substrate vias, while signal lines remain on the front side, eliminating interconnect resource sharing conflicts without requiring excessive substrate thinning.
Solution Approach 2:
The substrate is segmented into distinct functional regions: the front side handles signal processing with logic circuits, while the back side handles power delivery through dedicated power vias and power distribution networks. This segmentation allows independent optimization of power and signal paths without mutual interference.
2Ease of operation
If substrate thinning is performed to enable backside power access, then power delivery through backside is achieved, but process constraints are increased
Solution Approach 1:
Instead of requiring extreme substrate thinning, the patent modifies the thickness parameter to a moderate range that maintains substrate mechanical strength while enabling backside via formation. The substrate thickness is optimized to balance power delivery efficiency with manufacturing feasibility, avoiding overly thin substrates that would be difficult to handle and process.
Solution Approach 2:
Through-substrate vias act as intermediaries that bridge the front and back sides of the substrate. These vias provide a controlled pathway for power signals to traverse the substrate thickness without requiring the substrate to be excessively thin, distributing the mechanical stress and simplifying the thinning process.
3Area of stationary object
If power and signal lines share interconnect resources on the front side, then device area is reduced, but resource contention and interference occur
Solution Approach 1:
The patent resolves resource contention by moving power delivery to the backside dimension, creating vertical separation between power vias and front-side signal lines. This three-dimensional arrangement eliminates electromagnetic interference and signal integrity issues while maintaining compact device footprint, as power and signal paths occupy different spatial zones.
Data Source
AI summary
An electronic device is disclosed. The electronic device includes a unit chip. The unit chip includes an electronic component having a power delivery circuit and a reinforcement supporting the electronic component. The reinforcement is configured to transmit a power signal to the power delivery circuit. The reinforcement includes a thermosetting reinforcement or a glass reinforcement.